ESDALC6V1-5T6 STMicroelectronics, ESDALC6V1-5T6 Datasheet

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... Communication systems ■ Video equipment ■ Set top boxes Description The ESDALC6V1-5T6 is monolithic arrays designed to protect lines against ESD transients. The device is ideal for applications where both reduced print circuit board space and high ESD protection level are required. November 2009 ...

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... Symbol V = Breakdown voltage Leakage current @ Stand-off voltage RM Table 2. Electrical characteristics (values, T Symbol DC 2/12 amb Parameter (1) Parameter RM Test conditions = 1 MHz osc osc Doc ID 16741 Rev 1 ESDALC6V1-5T6 = 25 °C) Value initial = amb 2 125 -55 + 150 260 Slope: 1 °C) amb Min. Typ. Max. 6.1 7 RMS Unit ° ...

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... ESDALC6V1-5T6 Figure 3. Relative variation of peak pulse power versus initial junction temperature P [T initial]/P [T initial = 25 ° 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Figure 5. Clamping voltage versus peak pulse current (typical values, exponential waveform) I (A) PP 10.0 Wave 8/20 µ °C 1 ...

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... Figure 10. Analog crosstalk measurements 0.00 -20.00 -40.00 -60.00 -80.00 -100.00 -120.00 F/Hz -140.00 100.0M 1.0G Figure 12. ESD response to IEC 6100-4-2 5 V/Div C2 100 ns/Div Doc ID 16741 Rev 1 ESDALC6V1-5T6 between channels F/Hz 100.0K 1.0M 10.0M 100.0M 1.0G (-15 kV air discharge) on each channel 100 ns/Div ...

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... ESDALC6V1-5T6 2 Ordering information scheme Figure 13. Ordering information scheme ESD array Low capacitance Breakdown voltage 6V1 = 6.1 Volts min Package lines T = Micro DFN, pitch 0. pads Ordering information scheme ESDA LC Doc ID 16741 Rev 1 6V1 5T6 5/12 ...

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... Index area (D/2xE/ PIN BOTTOM VIEW D SEATING E PLANE L1 e 0.175 0.150 0.375 0.200 0.900 Doc ID 16741 Rev 1 ESDALC6V1-5T6 Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. 0.31 - 0.40 0.012 0.00 0.02 0.05 0.00 0.0008 0.002 0.10 0.15 0.20 0.004 0.006 0.008 ...

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... ESDALC6V1-5T6 Figure 15. Tape and reel specifications 0.23 ± 0.02 0.53± 0.05 All dimensions in mm 2.0 ± 0.05 4.0 ± 0 1.13 ± 0.05 User direction of unreeling Doc ID 16741 Rev 1 Package information Ø 1.50 + 0.10 / -0.00 K 2.0 ± 0.05 7/12 ...

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... Stencil opening for leads: Opening to footprint ratio is 90%. Figure 17. Recommended stencil window position 8/ ≥ ---- - = 1.5 T × ≥ --------------------------- - = 0. 150 µm 175 µm 175 µm Doc ID 16741 Rev 1 ESDALC6V1-5T6 W T=100 µm and opening ratio is 100% 0.175 0.150 0.175 0.520 1.280 0.240 0.560 0.520 0.375 0.200 0.900 Footprint Stencil window Footprint ...

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... ESDALC6V1-5T6 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. 4.3 Placement 1. Manual positioning is not recommended. ...

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... Minimize air convection currents in the reflow oven to avoid component movement. 10/12 ® recommended soldering reflow profile for PCB mounting 3°C/s max 3°C/s max 150 sec 90 to 150 sec Doc ID 16741 Rev 1 ESDALC6V1-5T6 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) ...

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... ESDALC6V1-5T6 5 Ordering information Table 4. Ordering information Order code ESDALC6V1-5T6 6 Revision history Table 5. Document revision history Date 05-Nov-2009 Marking Package K DFN1.0x1.0-6L Revision 1 Initial release. Doc ID 16741 Rev 1 Ordering information Weight Base qty Delivery mode 1.78 mg 3000 Tape and reel Changes 11/12 ...

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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 12/12 Please Read Carefully: © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 16741 Rev 1 ESDALC6V1-5T6 ...