PIC16F505-I/P Microchip Technology, PIC16F505-I/P Datasheet - Page 109

• Manufacturer Part Number: PIC16F505-I/P
• Description: IC MCU FLASH 1KX12 14DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F505-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.5KB (1K x 12)
• Package / Case: 14-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 11
• Ram Size: 72 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 72 B
• Interface Type: RS- 232, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162070 - HEADER INTRFC MPLAB ICD2 8/14PAC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDM163029 - BOARD PICDEM FOR MECHATRONICSDVA16XP140 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2009 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
Note:
PART NO.
Device
Tape and Reel available for only the following packages: SOIC, MSOP
and TSSOP.
Temperature
PIC16F505
PIC12F508
PIC12F509
PIC16F505T
PIC12F508T
PIC12F509T
I
E
MC
MS
P
SL
SN
ST
MG
Special Requirements
Range
=
=
X
=
=
=
=
=
=
=
-40°C to +85°C (Industrial)
-40°C to +125°C (Extended)
(1)
(2)
(2)
8L DFN 2x3 (DUAL Flatpack No-Leads)
Micro-Small Outline Package (MSOP)
Plastic (PDIP)
14L Small Outline, 3.90 mm (SOIC)
8L Small Outline, 3.90 mm Narrow (SOIC)
Thin Shrink Small Outline (TSSOP)
16L QFN (3x3x0.9)
Package
/XX
(4)
(5)
Pattern
XXX
(4)
(4)
PIC12F508/509/16F505
(3, 4)
(3, 4)
(4)
Note 1:
Examples:
a)
b)
c)
2:
3:
4:
5:
PIC12F508-E/P 301 = Extended Temp., PDIP
package, QTP pattern #301
PIC12F508-I/SN = Industrial Temp., SOIC
package
PIC12F508T-E/P = Extended Temp., PDIP
package, Tape and Reel
T
T
PIC12F508/PIC12F509 only.
Pb-free.
PIC16F505 only.
= in tape and reel SOIC, TSSOP and
= in tape and reel SOIC and MSOP
QFN packages only
packages only.
.
DS41236E-page 109