PIC16F505-I/P Microchip Technology, PIC16F505-I/P Datasheet - Page 72

• Manufacturer Part Number: PIC16F505-I/P
• Description: IC MCU FLASH 1KX12 14DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F505-I/P

• Program Memory Type: FLASH
• Program Memory Size: 1.5KB (1K x 12)
• Package / Case: 14-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 11
• Ram Size: 72 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 72 B
• Interface Type: RS- 232, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162070 - HEADER INTRFC MPLAB ICD2 8/14PAC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDM163029 - BOARD PICDEM FOR MECHATRONICSDVA16XP140 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F508/509/16F505
10.2
DS41236E-page 72
DC Characteristics
D001
D002
D003
D004
D010
D020
D022
Note 1:
Param
No.
2:
3:
4:
5:
*
DC Characteristics: PIC12F508/509/16F505 (Extended)
V
S
Sym.
I
V
V
I
WDT
I
POR
VDD
DD
PD
These parameters are characterized but not tested.
guidance only and is not tested.
This is the limit to which V
The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
V
For standby current measurements, the conditions are the same as IDD, except that the device is in Sleep
mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep.
DD
DR
Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
DD
; WDT enabled/disabled as specified.
Supply Voltage
RAM Data Retention Voltage
V
Power-on Reset
V
Power-on Reset
Supply Current
Power-down Current
WDT Current
DD
DD
Start Voltage to ensure
Rise Rate to ensure
Characteristic
(5)
(3,4)
DD
DD
(5)
can be lowered in Sleep mode without losing RAM data.
measurements in active operation mode are:
(2)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature -40°C ≤ T
0.05*
Min.
2.0
—
—
—
—
—
—
—
—
—
—
—
—
Typ
0.625
0.35
1.5*
Vss
175
500
1.5
0.1
1.0
7.0
11
38
—
(1)
Max.
15.0
275
650
110
5.5
1.1
2.2
9.0
26
18
22
—
—
—
Units
V/ms
mA
mA
μA
μA
μA
μA
μA
μA
μA
μA
V
V
V
See Figure 10-1
Device in Sleep mode
See Section 7.4 "Power-on
Reset (POR)" for details
See Section 7.4 "Power-on
Reset (POR)" for details
F
F
F
F
(PIC16F515 only)
F
F
V
V
V
V
OSC
OSC
OSC
OSC
OSC
OSC
A
DD
DD
DD
DD
≤ +125°C (extended)
© 2009 Microchip Technology Inc.
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 4 MHz, V
= 4 MHz, V
= 10 MHz, V
= 20 MHz, V
= 32 kHz, V
= 32 kHz, V
SS
, T0CKI = V
Conditions
DD
DD
DD
DD
DD
DD
= 2.0V
= 5.0V
DD
= 2.0V
= 5.0V
= 3.0V
= 5.0V
, MCLR =