PIC12F635-I/MD Microchip Technology, PIC12F635-I/MD Datasheet - Page 219

• Manufacturer Part Number: PIC12F635-I/MD
• Description: IC PIC MCU FLASH 1KX14 8DFN
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-I/MD

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DFN
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 64Byte
• Cpu Speed: 20MHz
• No. Of Timers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164326 - MODULA SKT PM3 20QFNXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFNAC162057 - MPLAB ICD 2 HEADER 14DIPXLT08DFN - SOCKET TRANSITION ICE 8DFN
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

14-Lead Plastic Dual In-Line (P or PD) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
© 2007 Microchip Technology Inc.
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
e
PIC12F635/PIC16F636/639
Units
eB
A2
A1
E1
b1
N
A
E
D
e
L
c
b
A2
E1
.115
.015
.290
.240
.735
.115
.008
.045
.014
MIN
–
–
L
.100 BSC
INCHES
NOM
.310
.750
.130
.060
.018
.130
.250
.010
14
–
–
–
Microchip Technology Drawing C04-005B
MAX
.210
.195
.325
.280
.775
.150
.015
.070
.022
.430
eB
–
E
DS41232D-page 217
c