DSPIC30F3012-30I/SO Microchip Technology, DSPIC30F3012-30I/SO Datasheet - Page 159

• Manufacturer Part Number: DSPIC30F3012-30I/SO
• Description: IC DSPIC MCU/DSP 24K 18SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3012-30I/SO

• Program Memory Type: FLASH
• Program Memory Size: 24KB (8K x 24)
• Package / Case: 18-SOIC (7.5mm Width)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 12
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 12
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 18SOIC W
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Interface Type: I2C/SPI/UART
• On-chip Adc: 8-chx12-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301230ISO

TABLE 20-12: DC CHARACTERISTICS: PROGRAM AND EEPROM
© 2010 Microchip Technology Inc.
DC CHARACTERISTICS
D120
D121
D122
D123
D124
D130
D131
D132
D133
D134
D135
D137
D138
Note 1:
Param
No.
2:
E
V
T
T
I
E
V
V
V
T
T
I
I
Symbol
DEW
PEW
EB
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
DEW
RETD
EB
PEW
RETD
D
DRW
P
PR
PEW
Data EEPROM Memory
Byte Endurance
V
Erase/Write Cycle Time
Characteristic Retention
I
Program Flash Memory
Cell Endurance
V
V
V
Erase/Write Cycle Time
Characteristic Retention
I
I
DD
DD
DD
DD
DD
DD
DD
During Programming
During Programming
During Programming
for Read/Write
for Read
for Bulk Erase
for Erase/Write
Characteristic
dsPIC30F2011/2012/3012/3013
(2)
(2)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
100K
V
V
10K
Min
0.8
3.0
0.8
4.5
40
40
—
—
—
MIN
MIN
Typ
100K
100
100
1M
10
10
10
—
—
—
—
2
2
(1)
Max
5.5
2.6
5.5
5.5
5.5
2.6
—
—
30
—
30
30
—
-40°C ≤ T
-40°C ≤ T
Units
Year
Year
E/W
E/W
mA
mA
mA
ms
ms
V
V
V
V
-40° C ≤ T
Using EECON to Read/Write
V
voltage
RTSP
Provided no other specifications
are violated
Row Erase
-40° C ≤ T
V
voltage
RTSP
Provided no other specifications
are violated
Row Erase
Bulk Erase
A
A
MIN
MIN
≤ +85°C for Industrial
≤ +125°C for Extended
= Minimum operating
= Minimum operating
A
A
Conditions
≤ +85°C
≤ +85°C
DS70139G-page 159