DSPIC30F3012-30I/ML Microchip Technology, DSPIC30F3012-30I/ML Datasheet - Page 170

IC DSPIC MCU/DSP 24K 44QFN

DSPIC30F3012-30I/ML

Manufacturer Part Number
DSPIC30F3012-30I/ML
Description
IC DSPIC MCU/DSP 24K 44QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F3012-30I/ML

Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
24KB (8K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
For Use With
XLT44QFN5 - SOCKET TRANS ICE 18DIP TO 44QFNAC164322 - MODULE SOCKET MPLAB PM3 28/44QFNDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F301230IML

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F3012-30I/ML
Manufacturer:
Microchip Technology
Quantity:
135
dsPIC30F2011/2012/3012/3013
FIGURE 20-10:
TABLE 20-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
DS70139G-page 170
AC CHARACTERISTICS
OC10
OC11
Note 1:
Param
No.
2:
TccF
TccR
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
OCx Output Rise Time
OCx Output Fall Time
OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
Note: Refer to
(Output Compare
Characteristic
or PWM Mode)
OCx
Figure 20-3
(1)
OC11
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
for load conditions.
Min
Typ
(2)
OC10
Max
-40°C ≤ T
-40°C ≤ T
Units
ns
ns
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
© 2010 Microchip Technology Inc.
See Parameter
See Parameter
Conditions
DO32
DO31

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