DSPIC30F3014-20I/ML Microchip Technology, DSPIC30F3014-20I/ML Datasheet - Page 172
DSPIC30F3014-20I/ML
Manufacturer Part Number
DSPIC30F3014-20I/ML
Description
IC DSPIC MCU/DSP 24K 44QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F3014-30IPT.pdf
(228 pages)
2.DSPIC30F3014-30IPT.pdf
(16 pages)
3.DSPIC30F3014-30IPT.pdf
(6 pages)
4.DSPIC30F3014-30IPT.pdf
(14 pages)
5.DSPIC30F3014-30IPT.pdf
(20 pages)
6.DSPIC30F3014-20IP.pdf
(226 pages)
Specifications of DSPIC30F3014-20I/ML
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
30
Program Memory Size
24KB (8K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
30
Flash Memory Size
24KB
Supply Voltage Range
2.5V To 5.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44QFN2 - SOCKET TRAN ICE 44QFN/40DIPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F301420IML
- DSPIC30F3014-30IPT PDF datasheet
- DSPIC30F3014-30IPT PDF datasheet #2
- DSPIC30F3014-30IPT PDF datasheet #3
- DSPIC30F3014-30IPT PDF datasheet #4
- DSPIC30F3014-30IPT PDF datasheet #5
- DSPIC30F3014-20IP PDF datasheet #6
- Current page: 172 of 228
- Download datasheet (2Mb)
dsPIC30F3014/4013
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
DS70138G-page 172
dsPIC30F3014-30I
dsPIC30F4013-30I
dsPIC30F3014-20E
dsPIC30F4013-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 40-pin DIP (P)
Package Thermal Resistance, 44-pin TQFP (10x10x1mm)
Package Thermal Resistance, 44-pin QFN
Note 1:
V
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
I
INT
/
Junction to ambient thermal resistance, Theta-ja (
O
Range
=
=
V
OPERATING MIPS vs. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
D D
V
D D
I
–
D D
V
Characteristic
–
O H
I
Rating
I
O H
-40°C to 125°C
-40°C to 125°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
Temp Range
OH
+
V
O L
I
O L
dsPIC30FXXX-30I
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
15
10
—
—
P
DMAX
P
T
T
T
T
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
-40
-40
-40
-40
—
—
—
(T
2010 Microchip Technology Inc.
P
J
INT
– T
Max
39.3
27.8
Typ
47
—
—
—
—
dsPIC30FXXX-20E
+ P
A
)/
I
/
O
JA
°C/W
°C/W
°C/W
+125
+150
+125
—
20
—
10
—
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
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