PIC24HJ64GP506A-I/PT Microchip Technology, PIC24HJ64GP506A-I/PT Datasheet - Page 292

• Manufacturer Part Number: PIC24HJ64GP506A-I/PT
• Description: IC PIC MCU FLASH 64KB 64-TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP506A-I/PT

• Core Size: 16-Bit
• Program Memory Size: 64KB (22K x 24)
• Core Processor: PIC
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TFQFP
• Controller Family/series: PIC24
• No. Of I/o's: 53
• Ram Memory Size: 8KB
• Cpu Speed: 40MHz
• No. Of Timers: 9
• Interface: CAN, I2C, SPI, UART
• Embedded Interface Type: CAN, I2C, SPI, UART
• Rohs Compliant: Yes
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8192 B
• Interface Type: SPI, I2C, UART
• Maximum Clock Frequency: 7.37 MHz
• Number Of Timers: 13
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC24HJXXXGPX06A/X08A/X10A
DS70592B-page 292
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
e
b
β
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
D
D1
Dimension Limits
Preliminary
NOTE 2
E1
φ
L
Units
A2
A1
E1
D1
L1
N
A
E
D
e
L
φ
b
α
β
c
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-110B
 2009 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
A2
α