PIC18F2550-I/SP Microchip Technology, PIC18F2550-I/SP Datasheet - Page 6

• Manufacturer Part Number: PIC18F2550-I/SP
• Description: IC PIC MCU FLASH 16KX16 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2550-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1536 B
• Interface Type: SPI, I2C, EAUSART
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163025, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• Package: 28SPDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 48 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: I3-DB18F4550 - BOARD DAUGHTER ICEPIC3DM163025 - PIC DEM FULL SPEED USB DEMO BRDDVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2455/2550/4455/4550
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 113
11.0 Timer0 Module ......................................................................................................................................................................... 127
12.0 Timer1 Module ......................................................................................................................................................................... 131
13.0 Timer2 Module ......................................................................................................................................................................... 137
14.0 Timer3 Module ......................................................................................................................................................................... 139
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 143
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 151
17.0 Universal Serial Bus (USB) ...................................................................................................................................................... 165
18.0 Streaming Parallel Port ............................................................................................................................................................ 191
19.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 197
20.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 243
21.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 265
22.0 Comparator Module.................................................................................................................................................................. 275
23.0 Comparator Voltage Reference Module ................................................................................................................................... 281
24.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 285
25.0 Special Features of the CPU .................................................................................................................................................... 291
26.0 Instruction Set Summary .......................................................................................................................................................... 313
27.0 Development Support............................................................................................................................................................... 363
28.0 Electrical Characteristics .......................................................................................................................................................... 367
29.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 407
30.0 Packaging Information.............................................................................................................................................................. 409
Appendix A: Revision History............................................................................................................................................................. 419
Appendix B: Device Differences......................................................................................................................................................... 419
Appendix C: Conversion Considerations ........................................................................................................................................... 420
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 420
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 421
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 421
Index .................................................................................................................................................................................................. 423
The Microchip Web Site ..................................................................................................................................................................... 433
Customer Change Notification Service .............................................................................................................................................. 433
Customer Support .............................................................................................................................................................................. 433
Reader Response .............................................................................................................................................................................. 434
PIC18F2455/2550/4455/4550 Product Identification System ............................................................................................................ 435
DS39632E-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power-Managed Modes ............................................................................................................................................................. 35
Reset .......................................................................................................................................................................................... 45
Memory Organization ................................................................................................................................................................. 59
Flash Program Memory .............................................................................................................................................................. 81
Data EEPROM Memory ............................................................................................................................................................. 91
8 x 8 Hardware Multiplier............................................................................................................................................................ 97
Interrupts .................................................................................................................................................................................... 99
© 2009 Microchip Technology Inc.