PIC18F2550-I/SP Microchip Technology, PIC18F2550-I/SP Datasheet - Page 10

• Manufacturer Part Number: PIC18F2550-I/SP
• Description: IC PIC MCU FLASH 16KX16 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2550-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1536 B
• Interface Type: SPI, I2C, EAUSART
• Maximum Clock Frequency: 48 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163025, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• Package: 28SPDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 48 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: I3-DB18F4550 - BOARD DAUGHTER ICEPIC3DM163025 - PIC DEM FULL SPEED USB DEMO BRDDVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2455/2550/4455/4550
26. Module: MSSP
27. Module: MSSP
DS80220J-page 10
With MSSP in SPI Master mode, F
Timer2/2 clock rate and CKE = 0, a write collision
may occur if SSPBUF is loaded immediately after
the transfer is complete. A delay may be required
after the MSSP Interrupt Flag bit, SSPIF, is set or
the Buffer Full bit, BF, is set, and before writing
SSPBUF. If the delay is insufficiently short, a write
collision may occur as indicated by the WCOL bit
being set.
Work around
Add a software delay of one SCK period after
detecting the completed transfer and prior to
updating the SSPBUF contents. Verify the WCOL
bit is clear after writing SSPBUF. If the WCOL is
set, clear the bit in software and rewrite the
SSPBUF register.
Date Codes that pertain to this issue:
All engineering and production devices.
In an I
unaddressed slave may respond to bus activity
when data on the bus matches its address. The
first occurrence will set the BF bit. The second
occurrence will set the BF and the SSPOV bits. In
both situations, the SSPIF bit is not set and an
interrupt will not occur. The device will vector to the
Interrupt Service Routine only if the interrupt is
enabled and an address match occurs.
Work around
The I
I
Date Codes that pertain to this issue:
All engineering and production devices.
2
C event to maintain normal operation.
2
C slave must clear the SSPOV bit after each
2
C system with multiple slave nodes, an
OSC
/64 or
28. Module: MSSP (SPI Mode)
FIGURE 1:
EXAMPLE 6:
LOOP BTFSSPIR1, SSPIF
When the SPI is using Timer2/2 as the clock
source, a shorter than expected SCK pulse may
occur on the first bit of the transmitted/received
data (Figure 1).
Work around
To avoid producing the short pulse, turn off Timer2
and clear the TMR2 register, load the SSPBUF
with the data to transmit and then turn Timer2 back
on. Refer to Example 6 for sample code.
Date Codes that pertain to this issue:
All engineering and production devices.
BRA LOOP
BCF PIR1, SSPIF ;Clear flag
MOVFSSPBUF, W
MOVWFRXDATA
MOVFTXDATA, W
BCF T2CON, TMR2ON;Timer2 off
CLRFTMR2
MOVWFSSPBUF
SDO
SCK
Write SSPBUF
bit 7 = 1 bit 6 = 0
SCK PULSE VARIATION
USING TIMER2/2
AVOIDING THE INITIAL
SHORT SCK PULSE
;(Xmit complete?)
;Save in user RAM
;W = TXDATA
;Clear Timer2
;Xmit New data
© 2008 Microchip Technology Inc.
;No
;W = SSPBUF
;Data received?
bit 5 = 1
. . . .