PIC16F876-20/SO Microchip Technology, PIC16F876-20/SO Datasheet - Page 615

• Manufacturer Part Number: PIC16F876-20/SO
• Description: IC MCU FLASH 8KX14 EE 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F876-20/SO

• Program Memory Type: FLASH
• Program Memory Size: 14KB (8K x 14)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: MSSP, PSP, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
• Minimum Operating Temperature: 0 C
• On-chip Adc: 10 bit, 5 Channel
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Data Rom Size: 256 B
• A/d Bit Size: 10 bit
• A/d Channels Available: 5
• Height: 2.31 mm
• Length: 17.87 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4 V
• Width: 7.49 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

31.3.1
1997 Microchip Technology Inc.
I
PD
vs. V
DD
I
referred to as power-down current. These tests are taken with all I/O as inputs, either pulled high
or low. That is, there are no floating inputs, nor are any pins driving an output (with a load).
The characterization shows graphs for both the Watchdog Timer (WDT) disabled and enabled.
This is required since the WDT requires an on-chip RC oscillator which consumes additional cur-
rent.
Since the device may have certain features and modules that can operate while the device is in
sleep mode. Some of these modules are:
• Watchdog Timer (WDT)
• Brown-out Reset (BOR) circuitry
• Timer1
• Analog to Digital converter
• LCD module
• Comparators
• Voltage Reference
If these features are operating while the device is in sleep mode, a higher current will be con-
sumed. When all features are disabled, the device will consume the lowest possible current (the
leakage current). If more then one feature is enabled then the expected current can easily be cal-
culated as the base current (everything disabled and in sleep mode) plus all delta currents.
Example 31-1
WDT and Timer1 oscillator enabled.
Example 31-1:I
PD
Base Current
WDT Delta Current
Timer1 Delta Current
Total Sleep Current
is the current (I) that the device consumes when the device is in sleep mode (power-down),
Section 31. Device Characteristics
shows an example of calculating the typical currents for a device at 5V, with the
PD
Calculations with WDT and TIMER1 Oscillator Enabled (@ 5V)
14 nA
14 A
22 A
36 A
; Device leakage current
; 14 A - 14 nA = 14 A
; 22 A - 14 nA = 22 A
;
DS31031A-page 31-3
31