PIC16F876-20/SO Microchip Technology, PIC16F876-20/SO Datasheet - Page 66

IC MCU FLASH 8KX14 EE 28SOIC

PIC16F876-20/SO

Manufacturer Part Number
PIC16F876-20/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F876-20/SO

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
10 bit, 5 Channel
Package
28SOIC W
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Data Rom Size
256 B
A/d Bit Size
10 bit
A/d Channels Available
5
Height
2.31 mm
Length
17.87 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F876-20/SO
Manufacturer:
MCI
Quantity:
56
Part Number:
PIC16F876-20/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PICmicro MID-RANGE MCU FAMILY
3.4
DS31003A-page 3-16
Design Tips
Question 1:
Answer 1:
If the device you are using does not have filtering to the on-chip master clear circuit
ensure that proper external filtering is placed on the MCLR pin to remove narrow pulses. Electri-
cal Specification
Question 2:
Answer 2:
The most common reason for this is that the windowed device (JW) has not had its window cov-
ered. The background light causes the device to power-up in a different state than would typically
be seen in a device where no light is present. In most cases all the General Purpose RAM and
Special Function Registers were not initialized properly.
When my system is subjected to an environment with ESD and EMI, it oper-
ates erratically.
With JW (windowed) devices my system resets and operates properly. With
an OTP device, my system does not operate properly.
parameter 35
specifies the pulse width required to cause a reset.
1997 Microchip Technology Inc.
(Appendix
C),

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