PIC18C252-I/SP Microchip Technology, PIC18C252-I/SP Datasheet - Page 285
![IC MCU OTP 16KX16 A/D 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18C252-I/SP
Manufacturer Part Number
PIC18C252-I/SP
Description
IC MCU OTP 16KX16 A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16C770-ISO.pdf
(8 pages)
3.PIC18C242-ISO.pdf
(305 pages)
4.PIC18C242-ISO.pdf
(12 pages)
Specifications of PIC18C252-I/SP
Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
22
Program Memory Type
OTP
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
23
Ram Memory Size
1.5KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1536 B
Interface Type
MSSP, SPI, I2C, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
23
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
ICE2000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DB18C452 - BOARD DAUGHTER ICEPIC3
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18C252-I/SP
Manufacturer:
MAX
Quantity:
38
- PIC16F616T-ISL PDF datasheet
- PIC16C770-ISO PDF datasheet #2
- PIC18C242-ISO PDF datasheet #3
- PIC18C242-ISO PDF datasheet #4
- Current page: 285 of 305
- Download datasheet (6Mb)
40-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
2001 Microchip Technology Inc.
W
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Diameter
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-014
n
eB
E1
E
Dimension Limits
2
1
§
D
c
Units
A2
B1
eB
A1
E1
W
A
E
D
n
p
L
c
B
A2
MIN
2.040
.185
.155
.030
.595
.514
.135
.008
.050
.016
.610
.340
INCHES*
NOM
2.050
.100
.205
.160
.045
.600
.520
.140
.053
.020
.660
.350
.011
40
MAX
B
B1
2.060
.225
.165
.060
.625
.526
.145
.014
.055
.023
.710
.360
MIN
13.06
15.49
51.82
15.11
4.70
3.94
0.76
3.43
0.20
1.27
8.64
0.41
MILLIMETERS
PIC18CXX2
NOM
15.24
52.07
16.76
13.21
2.54
4.06
1.14
3.56
0.28
1.33
8.89
5.21
0.51
p
40
DS39026C-page 283
MAX
A1
15.88
13.36
52.32
18.03
4.19
3.68
0.36
1.40
0.58
9.14
5.72
1.52
A
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