PIC16C72-20I/SP Microchip Technology, PIC16C72-20I/SP Datasheet - Page 262

IC MCU OTP 2KX14 A/D PWM 28DIP

PIC16C72-20I/SP

Manufacturer Part Number
PIC16C72-20I/SP
Description
IC MCU OTP 2KX14 A/D PWM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr

Specifications of PIC16C72-20I/SP

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C, SPI, SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
1 x 16 bit
Operating Supply Voltage
2.5 V to 6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
PIC16C7X
Package Marking Information (Cont’d)
DS30390E-page 262
44-Lead TQFP
MMMMMMMM
XXXXXXXXXX
XXXXXXXXXX
*
Note:
AABBCDE
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
Legend:
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
MM...M
XX...X
AA
BB
C
D 1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
Example
PIC16C74A
-10/TQ
AABBCDE
1997 Microchip Technology Inc.

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