PIC18F4680-I/PT Microchip Technology, PIC18F4680-I/PT Datasheet - Page 6

IC MCU FLASH 32KX16 44TQFP

PIC18F4680-I/PT

Manufacturer Part Number
PIC18F4680-I/PT
Description
IC MCU FLASH 32KX16 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4680-I/PT

Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
44-TQFP, 44-VQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.25 KB
Interface Type
I2C/SPI/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
44
Number Of Timers
4
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163011
Minimum Operating Temperature
- 25 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPI3-DB18F4680 - BOARD DAUGHTER ICEPIC3AC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F4680-I/PT
Manufacturer:
LATTICE
Quantity:
2 667
Part Number:
PIC18F4680-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F4680-I/PT
0
PIC18F2585/2680/4585/4680
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 129
11.0 Timer0 Module ......................................................................................................................................................................... 147
12.0 Timer1 Module ......................................................................................................................................................................... 151
13.0 Timer2 Module ......................................................................................................................................................................... 157
14.0 Timer3 Module ......................................................................................................................................................................... 159
15.0 Capture/Compare/PWM (CCP1) Modules ............................................................................................................................... 163
16.0 Enhanced Capture/Compare/PWM (ECCP1) Module.............................................................................................................. 173
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 187
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 227
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 247
20.0 Comparator Module.................................................................................................................................................................. 257
21.0 Comparator Voltage Reference Module ................................................................................................................................... 263
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 267
23.0 ECAN™ Module ....................................................................................................................................................................... 273
24.0 Special Features of the CPU .................................................................................................................................................... 343
25.0 Instruction Set Summary .......................................................................................................................................................... 361
26.0 Development Support............................................................................................................................................................... 411
27.0 Electrical Characteristics .......................................................................................................................................................... 417
28.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 453
29.0 Packaging Information.............................................................................................................................................................. 455
Appendix A: Revision History............................................................................................................................................................. 463
Appendix B: Device Differences......................................................................................................................................................... 463
Appendix C: Conversion Considerations ........................................................................................................................................... 464
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 464
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 465
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 465
Index .................................................................................................................................................................................................. 467
On-Line Support................................................................................................................................................................................. 479
Systems Information and Upgrade Hot Line ...................................................................................................................................... 479
Reader Response .............................................................................................................................................................................. 480
PIC18F2585/2680/4585/4680 Product Identification System ............................................................................................................ 481
DS39625B-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power Managed Modes ............................................................................................................................................................. 33
Reset .......................................................................................................................................................................................... 41
Memory Organization ................................................................................................................................................................. 61
Flash Program Memory .............................................................................................................................................................. 95
Data EEPROM Memory ........................................................................................................................................................... 105
8 x 8 Hardware Multiplier.......................................................................................................................................................... 111
Interrupts .................................................................................................................................................................................. 113
Preliminary
 2004 Microchip Technology Inc.

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