LPC2157FBD100,551 NXP Semiconductors, LPC2157FBD100,551 Datasheet - Page 34
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LPC2157FBD100,551
Manufacturer Part Number
LPC2157FBD100,551
Description
IC ARM7 MCU FLASH 512K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2100r
Datasheet
1.LPC2157FBD100551.pdf
(45 pages)
Specifications of LPC2157FBD100,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
60MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
38
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC21
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
40 KB
Interface Type
I2C/SPI
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
38
Number Of Timers
2
Operating Supply Voltage
2.4 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCD568-4297 - BOARD EVAL LPC21XX MCB2100622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4524
935287348551
935287348551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2157FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
Table 7.
T
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] Applies to P1[16] to P1[31].
[11] On pin VBAT.
[12] Optimized for low battery consumption.
[13] To V
[14] Includes external resistors of 18
LPC2157_2158_1
Product data sheet
Symbol
V
V
V
USB pins
I
V
V
V
V
V
V
C
Z
R
OZ
amb
DRV
o(XTAL2)
i(RTCX1)
o(RTCX2)
BUS
DI
CM
th(rs)se
OL
OH
trans
pu
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
Core and external rail.
The RTC typically fails when V
Including voltage on outputs in 3-state mode.
V
3-state outputs go into 3-state mode when V
Accounts for 100 mV voltage drop in all supply lines.
Allowed as long as the current limit does not exceed the maximum current allowed by the device.
Minimum condition for V
= 40 C to +85 C for commercial applications, unless otherwise specified.
DD
SS
supply voltages must be present.
.
Static characteristics
Parameter
output voltage on pin
XTAL2
input voltage on pin
RTCX1
output voltage on pin
RTCX2
OFF-state output
current
bus supply voltage
differential input
sensitivity voltage
differential common
mode voltage range
single-ended receiver
switching threshold
voltage
LOW-level output
voltage
HIGH-level output
voltage
transceiver capacitance pin to GND
driver output impedance
for driver which is not
high-speed capable
pull-up resistance
I
= 4.5 V, maximum condition for V
i(VBAT)
…continued
1 % on D+ and D .
drops below 1.6 V.
Conditions
0 V < V
|(D+)
includes V
R
R
steady state drive
SoftConnect = ON
L
L
of 1.5 k to 3.6 V
of 15 k to GND
DD
I
(D )|
is grounded.
< 3.3 V
DI
Rev. 01 — 15 October 2008
range
I
= 5.5 V.
[14]
Single-chip 16-bit/32-bit microcontrollers
Min
0
0
0
-
-
0.2
0.8
0.8
-
2.8
-
29
1.1
LPC2157/2158
Typ
-
-
-
-
-
-
-
-
-
-
-
-
-
[1]
© NXP B.V. 2008. All rights reserved.
Max
1.8
1.8
1.8
5.25
-
2.5
2.0
0.3
3.6
20
44
1.9
10
34 of 45
Unit
V
V
V
V
V
V
V
V
V
pF
k
A