LPC2468FBD208,551 NXP Semiconductors, LPC2468FBD208,551 Datasheet - Page 52

• Manufacturer Part Number: LPC2468FBD208,551
• Description: IC ARM7 MCU FLASH 512K 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2468FBD208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2S/ISP/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 6
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, IRD-LPC2468-DEV, SAB-TFBGA208, KSK-LPC2468-PL
• Development Tools By Supplier: OM10100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1025 - KIT DEV IND REF DESIGN LPC2468622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4358 - DISPLAY QVGA TFT FOR OM10100568-4309 - BOARD EXTENSION LPCSTICK568-4308 - EVAL LPC-STICK WITH LPC2468MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4261; 935282457551; LPC2468FBD208-S

NXP Semiconductors
LPC2468
Product data sheet
10.1 Power-down mode
Fig 5.
Fig 6.
I
DD(IO)
(μA)
(μA)
I
BAT
−2
−4
40
30
20
10
V
I/O maximum supply current I
RTC battery maximum supply current I
mode
V
4
2
0
0
−40
i(VBAT)
−40
DD(3V3)
All information provided in this document is subject to legal disclaimers.
= V
= V
DD(DCDC)(3V3)
DD(DCDC)(3V3)
Rev. 5 — 15 October 2010
−15
−15
V
V
i(VBAT)
i(VBAT)
= 3.3 V; T
= 3.3 V; T
= 3.3 V
= 3.0 V
amb
10
10
DD(IO)
amb
= 25 °C.
= 25 °C.
versus temperature in Power-down mode
BAT
V
V
DD(3V3)
DD(3V3)
35
35
versus temperature in Power-down
= 3.3 V
= 3.0 V
Single-chip 16-bit/32-bit micro
60
60
temperature (°C)
temperature (°C)
LPC2468
002aae049
002aae050
© NXP B.V. 2010. All rights reserved.
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