STM32F100VBT6B STMicroelectronics, STM32F100VBT6B Datasheet - Page 70
![MCU 32BIT 128K FLASH 100LQFP](/photos/12/15/121536/stmicroelectronics-_100-lqfp_sml.jpg)
STM32F100VBT6B
Manufacturer Part Number
STM32F100VBT6B
Description
MCU 32BIT 128K FLASH 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F100VBT6B
Featured Product
STM32 Value Line
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F100x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM32100B-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-10659
STM32F100VBT6B
STM32F100VBT6B
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F100VBT6B
Manufacturer:
STMicroelectronics
Quantity:
5 850
Company:
Part Number:
STM32F100VBT6B
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F100VBT6B
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
STM32F100VBT6BTR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Electrical characteristics
70/87
add a Schottky diode (pin to ground) to standard analog pins which may potentially inject
negative currents.
Any positive injection current within the limits specified for I
Section 5.3.12
Figure 32. ADC accuracy characteristics
Figure 33. Typical connection diagram using the ADC
1. Refer to
2. C
General PCB design guidelines
Power supply decoupling should be performed as shown in
depending on whether V
ceramic (good quality). They should be placed them as close as possible to the chip.
4095
4094
4093
pad capacitance (roughly 7 pF). A high C
this, f
7
6
5
4
3
2
1
parasitic
0
V
SSA
[1LSB
ADC
1
V AIN
Table 42
E
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
should be reduced.
IDEAL
O
2
does not affect the ADC accuracy.
=
V
R AIN (1)
4096
3
REF+
for the values of R
4
(or
C parasitic
V
5
REF+
1 LSB
4096
AINx
DDA
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
E
6
T
depending on package)]
IDEAL
is connected to V
Doc ID 16455 Rev 6
E
7
L
AIN
(2)
, R
V DD
parasitic
ADC
E
D
0.6 V
0.6 V
V T
V T
4093 4094 4095 4096
and C
(3)
value will downgrade conversion accuracy. To remedy
ADC
(1)
DDA
I L ±1 µA
.
E
G
or not. The 10 nF capacitors should be
V
DDA
Sample and hold ADC
converter
R ADC (1)
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
T
O
G
D
L
=Total Unadjusted Error: maximum deviation
=Integral Linearity Error: maximum deviation
=Differential Linearity Error: maximum deviation
INJ(PIN)
=Offset Error: deviation between the first actual
=Gain Error: deviation between the last ideal
Figure 34
C ADC (1)
converter
12-bit
STM32F10xxx
and ΣI
or
Figure
INJ(PIN)
ai14139d
35,
in
ai14395b