STM32F101V8T6 STMicroelectronics, STM32F101V8T6 Datasheet - Page 85

MCU ARM 64KB FLASH/TIMER 100LQFP

STM32F101V8T6

Manufacturer Part Number
STM32F101V8T6
Description
MCU ARM 64KB FLASH/TIMER 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101V8T6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
10 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
100
Number Of Timers
3 x 16 bit
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-6060

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STM32F101x8, STM32F101xB
Table 54.
22-Sep-2009
21-Apr-2009
Date
Document revision history (continued)
Revision
11
12
I/O information clarified
In
PB14, PB15, PB3/TRACESWO moved from Default column to Remap
column.
Note modified in
code with data processing running from Flash
current consumption in Sleep mode, code running from Flash or
Figure
Table 19: High-speed external user clock characteristics
Low-speed external user clock characteristics
ACC
Small text changes.
Note 5
STM32F101xx pin
V
voltage. Typical I
current consumptions in Stop and Standby
current consumption on VBAT with RTC on versus temperature at
different VBAT values
f
characteristics.
C
characteristics
32.768
Table 23: HSI oscillator characteristics
from
Figure 28: Recommended NRST pin protection
Note 1
crystal.
Figure 28: Recommended NRST pin protection
IEC 1000 standard updated to IEC 61000 and SAE J1752/3 updated to
IEC 61967-2 in
Jitter added to
modified in
Table 43: RAIN max for fADC = 14
Small text changes.
HSE_ext
RERINT
L1
Table 4: Medium-density STM32F101xx pin
and C
HSI
Doc ID 13586 Rev 14
Table 25: Low-power mode wakeup
16,
updated and
modified below
kHz), notes modified and moved below the tables.
max values modified in
min modified in
and T
L2
Figure 17
Table 42: ADC
replaced by C in
Coeff
Table 26: PLL
and
Section 5.3.10: EMC characteristics on page
DD_VBAT
Table 12: Maximum current consumption in Run mode,
definitions.
Table 22: LSE oscillator characteristics (fLSE =
added to
Note 4
and
added.
Figure 21: Typical application with an 8 MHz
on page
Table 19: High-speed external user clock
value added in
Figure 18
characteristics. R
added in
Table 11: Embedded internal reference
characteristics. C
Table 21: HSE 4-16 MHz oscillator
Changes
Table 23: HSI oscillator
1.
MHz.
Figure 8: Memory map
show typical curves.
Table 4: Medium-density
modified. Conditions removed
Table 15: Typical and maximum
timings.
modes.
AIN
modified.
ADC
definitions: PB4, PB13,
and
modified.
modified.
max values modified in
and R
Table 14: Maximum
Figure 15: Typical
Revision history
characteristics.
and
AIN
modified.
parameters
Table 20:
50.
RAM.
85/87

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