PIC16F882-I/SP Microchip Technology, PIC16F882-I/SP Datasheet - Page 254

IC PIC MCU FLASH 2KX14 28DIP

PIC16F882-I/SP

Manufacturer Part Number
PIC16F882-I/SP
Description
IC PIC MCU FLASH 2KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F882-I/SP

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
EUSART/MSSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
28
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164120-3
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
A/d Bit Size
10 bit
A/d Channels Available
11
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F882-I/SP
Manufacturer:
IR
Quantity:
3 000
Part Number:
PIC16F882-I/SP
0
PIC16F882/883/884/886/887
17.5
DS41291F-page 252
DC CHARACTERISTICS
D100
D101*
D101A* C
D120
D120A
D121
D122
D123
D124
D130
D130A
D131
D132
D133
D134
Note 1:
Param
No.
2:
3:
4:
5:
*
I
COSC2
E
E
V
T
T
T
E
E
V
V
T
T
DC Characteristics:
ULP
DEW
RETD
REF
PEW
RETD
D
D
DRW
P
D
PR
PEW
Sym.
IO
These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
Negative current is defined as current sourced by the pin.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
See Section 10.3.1 “Using the Data EEPROM” for additional information.
Including OSC2 in CLKOUT mode.
Ultra Low-Power Wake-Up
Current
Capacitive Loading Specs on
Output Pins
OSC2 pin
All I/O pins
Data EEPROM Memory
Byte Endurance
Byte Endurance
V
Erase/Write Cycle Time
Characteristic Retention
Number of Total Erase/Write
Cycles before Refresh
Program Flash Memory
Cell Endurance
Cell Endurance
V
V
V
Erase/Write cycle time
Characteristic Retention
DD
DD
DD
DD
for Read/Write
for Read
for Row Erase/Write
for Bulk Erase Operations
Characteristic
(4)
PIC16F883/884/886/887-I (Industrial)
PIC16F883/884/886/887-E (Extended) (Continued)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
100K
Min.
V
V
V
10K
10K
1M
4.5
40
1K
40
MIN
MIN
MIN
Typ†
100K
100K
10M
10K
200
1M
5
2
Max.
5.5
5.5
5.5
5.5
2.5
15
50
-40°C ≤ T
-40°C ≤ T
6
Units
Year Provided no other specifications
Year Provided no other specifications
E/W -40°C ≤ T
E/W +85°C ≤ T
E/W -40°C ≤ T
E/W -40°C ≤ T
E/W +85°C ≤ T
nA
ms
ms
pF
pF
V
V
V
V
A
A
≤ +85°C for industrial
≤ +125°C for extended
© 2009 Microchip Technology Inc.
See Application Note AN879,
“Using the Microchip Ultra
Low-Power Wake-up Module”
(DS00879)
In XT, HS and LP modes when
external clock is used to drive
OSC1
Using EECON1 to read/write
V
voltage
are violated
V
voltage
are violated
MIN
MIN
= Minimum operating
= Minimum operating
A
A
A
Conditions
A
A
≤ +85°C
≤ +85°C
≤ +85°C
≤ +125°C
≤ +125°C

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