PIC16F882-I/SP Microchip Technology, PIC16F882-I/SP Datasheet - Page 258

IC PIC MCU FLASH 2KX14 28DIP

PIC16F882-I/SP

Manufacturer Part Number
PIC16F882-I/SP
Description
IC PIC MCU FLASH 2KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F882-I/SP

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
EUSART/MSSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
28
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164120-3
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
A/d Bit Size
10 bit
A/d Channels Available
11
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F882-I/SP
Manufacturer:
IR
Quantity:
3 000
Part Number:
PIC16F882-I/SP
0
PIC16F882/883/884/886/887
TABLE 17-2:
DS41291F-page 256
Standard Operating Conditions (unless otherwise stated)
Operating Temperature
OS06
OS07
OS08
OS09*
OS10*
Note 1:
Param
No.
2:
3:
*
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
T
T
HF
LF
T
ST
These parameters are characterized but not tested.
and are not tested.
Instruction cycle period (T
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock)
for all devices.
To ensure these oscillator frequency tolerances, V
device as possible. 0.1 μF and 0.01 μF values in parallel are recommended.
By design.
SC
WARM
IOSC
Sym.
OSC
OSC
OSCILLATOR PARAMETERS
Internal Oscillator Switch
when running
Fail-Safe Sample Clock
Period
Internal Calibrated
HFINTOSC Frequency
Internal Uncalibrated
LFINTOSC Frequency
HFINTOSC Oscillator
Wake-up from Sleep
Start-up Time
Characteristic
(1)
-40°C ≤ T
(3)
CY
A
≤ +125°C
) equals four times the input oscillator time base period. All specified values are
(2)
Tolerance
Freq.
±1%
±2%
±5%
DD
Min.
7.92
7.84
7.60
5.5
3.5
15
3
and V
Typ†
SS
8.0
8.0
8.0
21
31
12
7
6
must be capacitively decoupled as close to the
Max.
8.08
8.16
8.40
45
24
14
11
2
Units
T
MHz
MHz
MHz
kHz
ms
OSC
μs
μs
μs
© 2009 Microchip Technology Inc.
Slowest clock
LFINTOSC/64
V
2.5V ≤ V
0°C ≤ T
2.0V ≤ V
-40°C ≤ T
-40°C ≤ T
V
V
V
DD
DD
DD
DD
= 3.5V, 25°C
= 2.0V, -40°C to +85°C
= 3.0V, -40°C to +85°C
= 5.0V, -40°C to +85°C
A
Conditions
DD
DD
≤ +85°C
A
A
≤ +85°C (Ind.),
≤ +125°C (Ext.)
≤ 5.5V,
≤ 5.5V,

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