PIC12F635-E/P Microchip Technology, PIC12F635-E/P Datasheet - Page 112
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12F635-E/P
Manufacturer Part Number
PIC12F635-E/P
Description
IC MCU FLASH 1KX14 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Specifications of PIC12F635-E/P
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
5
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Eeprom Memory Size
128Byte
Ram Memory Size
64Byte
Cpu Speed
20MHz
No. Of Timers
2
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232, SPI, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTER
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
- Current page: 112 of 234
- Download datasheet (4Mb)
PIC12F635/PIC16F636/639
11.26 Factory Calibration
Microchip
device-to-device variation in standby current, internal
timing and sensitivity, as well as channel-to-channel
sensitivity variation.
11.27 De-Q’ing of Antenna Circuit
When the transponder is close to the base station, the
transponder coil may develop coil voltage higher than
V
detects the strong near field signal through the AGC
control, and de-Q’ing the antenna circuit to reduce the
input signal amplitude.
FIGURE 11-8:
DS41232D-page 110
DE
V
_
Legend:
BAT
Q
. This condition is called “near field”. The AFE
calibrates
D
D
C
BLOCK
BLOCK
D
C
R
POOL
D
R
FLAT
COM
COM
LIM
LIM
LF FIELD POWERING AND BATTERY BACK-UP EXAMPLE
= LCCOM charging capacitor.
= Pool capacitor (or battery back-up capacitor), charges in field and powers device.
= Battery protection from reverse charge.
= Field rectifier diodes.
= Voltage limiting diode, may be required to limit V
= C
= Current limiting resistor, required for air coil in strong fields.
the
Schottky for low forward bias drop.
D
COM
LIM
AFE
discharge path.
V
DD
to
C
POOL
reduce
D
D
the
FLAT
FLAT
1
2
Air Coil
L
X
11.28 Battery Back-up and Batteryless
The device supports both battery back-up and
batteryless operation by the addition of external
components, allowing the device to be partially or
completely powered from the field.
Figure 11-8 shows an example of the external circuit for
the battery back-up.
Note:
R
L
C
Y
COM
X
R
LIM
Operation
DD
Voltage on L
voltage must not exceed the maximum LC
input voltage.
C
C
voltage when in strong fields.
COM
Y
L
Z
© 2007 Microchip Technology Inc.
CCOM
C
Z
LCCOM
combined with coil input
LCX
LCY
LCZ
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