PIC12F635-E/P Microchip Technology, PIC12F635-E/P Datasheet - Page 222
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12F635-E/P
Manufacturer Part Number
PIC12F635-E/P
Description
IC MCU FLASH 1KX14 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Specifications of PIC12F635-E/P
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
5
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Eeprom Memory Size
128Byte
Ram Memory Size
64Byte
Cpu Speed
20MHz
No. Of Timers
2
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232, SPI, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTER
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
- Current page: 222 of 234
- Download datasheet (4Mb)
PIC12F635/PIC16F636/639
16-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS41232D-page 220
Note:
E
A
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
EXPOSED
NOTE 1
A3
Units
A1
E2
D2
A3
N
A
E
D
K
e
b
L
E2
PAD
2
1
0.80
0.00
2.50
2.50
0.25
0.30
0.20
MIN
MILLIMETERS
BOTTOM VIEW
N
0.65 BSC
0.20 REF
4.00 BSC
4.00 BSC
NOM
0.90
0.02
2.65
0.30
0.40
2.65
16
–
Microchip Technology Drawing C04-127B
D2
© 2007 Microchip Technology Inc.
MAX
1.00
0.05
2.80
2.80
0.35
0.50
–
L
K
b
e
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