PIC12F635-E/P Microchip Technology, PIC12F635-E/P Datasheet - Page 217

• Manufacturer Part Number: PIC12F635-E/P
• Description: IC MCU FLASH 1KX14 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-E/P

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 64Byte
• Cpu Speed: 20MHz
• No. Of Timers: 2
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232, SPI, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTER
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
Dimension Limits
A1
PIC12F635/PIC16F636/639
E
A
Units
EXPOSED
A1
A3
E2
D2
N
A
D
E
K
e
b
L
PAD
NOTE 2
K
0.80
0.00
0.00
0.00
0.25
0.30
0.20
MIN
MILLIMETERS
b
0.80 BSC
4.00 BSC
4.00 BSC
0.20 REF
BOTTOM VIEW
NOM
0.90
0.02
2.20
3.00
0.30
0.55
8
–
Microchip Technology Drawing C04-131C
D2
2
e
1
MAX
1.00
0.05
2.80
3.60
0.35
0.65
N
–
DS41232D-page 215
E2
NOTE 1
L