ATMEGA8A-AU Atmel, ATMEGA8A-AU Datasheet - Page 2
![MCU AVR 8K FLASH 16MHZ 32-TQFP](/photos/6/91/69154/313-32-tqfp_sml.jpg)
ATMEGA8A-AU
Manufacturer Part Number
ATMEGA8A-AU
Description
MCU AVR 8K FLASH 16MHZ 32-TQFP
Manufacturer
Atmel
Series
AVR® ATmegar
Specifications of ATMEGA8A-AU
Core Processor
AVR
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
512 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-TQFP, 32-VQFP
Processor Series
ATMEGA8x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPI, TWI, USART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
23
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Controller Family/series
AVR MEGA
No. Of I/o's
23
Eeprom Memory Size
512Byte
Ram Memory Size
1KB
Cpu Speed
16MHz
Rohs Compliant
Yes
For Use With
ATSTK600 - DEV KIT FOR AVR/AVR32ATSTK500 - PROGRAMMER AVR STARTER KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ATMEGA8A-AU
Manufacturer:
NXP
Quantity:
1 001
Company:
Part Number:
ATMEGA8A-AU
Manufacturer:
ATM
Quantity:
10 000
Part Number:
ATMEGA8A-AU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
1. Pin Configurations
8159D–AVR–02/11
Figure 1-1.
Pinout ATmega8A
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
(XCK/T0) PD4
(XCK/T0) PD4
(INT1) PD3
(INT1) PD3
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
GND
GND
GND
GND
VCC
VCC
VCC
VCC
(XCK/T0) PD4
(RESET) PC6
(AIN0) PD6
(AIN1) PD7
(INT0) PD2
(INT1) PD3
(ICP1) PB0
(RXD) PD0
(TXD) PD1
(T1) PD5
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
GND
VCC
TQFP Top View
MLF Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PDIP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
PC5 (ADC5/SCL)
PC4 (ADC4/SDA)
PC3 (ADC3)
PC2 (ADC2)
PC1 (ADC1)
PC0 (ADC0)
GND
AREF
AVCC
PB5 (SCK)
PB4 (MISO)
PB3 (MOSI/OC2)
PB2 (SS/OC1B)
PB1 (OC1A)
24
23
22
21
20
19
18
17
24
23
22
21
20
19
18
17
NOTE:
The large center pad underneath the MLF
packages is made of metal and internally
connected to GND. It should be soldered
or glued to the PCB to ensure good
mechanical stability. If the center pad is
left unconneted, the package might
loosen from the PCB.
PC1 (ADC1)
PC0 (ADC0)
ADC7
GND
AREF
ADC6
AVCC
PB5 (SCK)
PC1 (ADC1)
PC0 (ADC0)
ADC7
GND
AREF
ADC6
AVCC
PB5 (SCK)
ATmega8A
2