PIC18F2331-E/MM Microchip Technology, PIC18F2331-E/MM Datasheet - Page 8

IC MCU FLASH 4KX16 28QFN

PIC18F2331-E/MM

Manufacturer Part Number
PIC18F2331-E/MM
Description
IC MCU FLASH 4KX16 28QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2331-E/MM

Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-QFN
Core
PIC
Processor Series
PIC18F
Data Bus Width
8 bit
Maximum Clock Frequency
40 MHz
Data Ram Size
768 B
Data Rom Size
256 B
On-chip Adc
Yes
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Mounting Style
SMD/SMT
A/d Bit Size
10 bit
A/d Channels Available
5
Height
0.88 mm
Interface Type
EUSART, I2C, SPI, SSP
Length
6 mm
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
5.5 V, 5.8 V
Supply Voltage (min)
3.9 V, 4.2 V
Width
6 mm
For Use With
I3-DB18F4431 - BOARD DAUGHTER ICEPIC3
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Other names
PIC18F2331-E/ML
PIC18F2331-E/ML
PIC18F2331/2431/4331/4431
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Interrupts .................................................................................................................................................................................... 97
11.0 I/O Ports ................................................................................................................................................................................... 113
12.0 Timer0 Module ......................................................................................................................................................................... 127
13.0 Timer1 Module ......................................................................................................................................................................... 131
14.0 Timer2 Module ......................................................................................................................................................................... 136
15.0 Timer5 Module ......................................................................................................................................................................... 139
16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 145
17.0 Motion Feedback Module ......................................................................................................................................................... 151
18.0 Power Control PWM Module .................................................................................................................................................... 173
19.0 Synchronous Serial Port (SSP) Module ................................................................................................................................... 205
20.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 217
21.0 10-Bit High-Speed Analog-to-Digital Converter (A/D) Module ................................................................................................. 239
22.0 Low-Voltage Detect (LVD)........................................................................................................................................................ 257
23.0 Special Features of the CPU .................................................................................................................................................... 263
24.0 Instruction Set Summary .......................................................................................................................................................... 283
25.0 Development Support............................................................................................................................................................... 325
26.0 Electrical Characteristics .......................................................................................................................................................... 329
27.0 Packaging Information.............................................................................................................................................................. 363
Appendix A: Revision History............................................................................................................................................................. 375
Appendix B: Device Differences......................................................................................................................................................... 375
Appendix C: Conversion Considerations ........................................................................................................................................... 376
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 376
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 377
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 377
INDEX ................................................................................................................................................................................................ 379
The Microchip Web Site ..................................................................................................................................................................... 389
Customer Change Notification Service .............................................................................................................................................. 389
Customer Support .............................................................................................................................................................................. 389
Reader Response .............................................................................................................................................................................. 390
Product Identification System............................................................................................................................................................. 391
DS39616D-page 8
Device Overview ........................................................................................................................................................................ 11
Guidelines for Getting Started with PIC18F Microcontrollers ..................................................................................................... 25
Oscillator Configurations ............................................................................................................................................................ 29
Power-Managed Modes ............................................................................................................................................................. 39
Reset .......................................................................................................................................................................................... 47
Memory Organization ................................................................................................................................................................. 61
Data EEPROM Memory ............................................................................................................................................................. 79
Flash Program Memory .............................................................................................................................................................. 85
8 x 8 Hardware Multiplier............................................................................................................................................................ 95
 2010 Microchip Technology Inc.

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