DSPIC30F4011-20E/PT Microchip Technology, DSPIC30F4011-20E/PT Datasheet - Page 213
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DSPIC30F4011-20E/PT
Manufacturer Part Number
DSPIC30F4011-20E/PT
Description
IC DSPIC MCU/DSP 48K 44TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F4012-30ISO.pdf
(238 pages)
2.DSPIC30F4012-30ISO.pdf
(18 pages)
3.DSPIC30F4012-30ISO.pdf
(6 pages)
4.DSPIC30F4012-30ISO.pdf
(16 pages)
5.DSPIC30F4012-30ISO.pdf
(22 pages)
6.DSPIC30F4011-30IP.pdf
(228 pages)
Specifications of DSPIC30F4011-20E/PT
Program Memory Type
FLASH
Program Memory Size
48KB (16K x 24)
Package / Case
44-TQFP, 44-VQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
30
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Data Rom Size
1024 B
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Package
44TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
9-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC30F006 - MODULE SKT FOR DSPIC30F 44TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F401120EPT
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F4011-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F4011-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
25.2
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
2005 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Package Details
n
β
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
eB
A2
A1
E1
B1
D
p
A
E
L
B
α
β
n
c
MIN
1.345
Preliminary
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.285
.100
.150
.130
.310
.130
.012
.053
.019
.350
10
10
dsPIC30F4011/4012
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
p
α
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
DS70135C-page 211
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15