DSPIC30F4011-20E/PT Microchip Technology, DSPIC30F4011-20E/PT Datasheet - Page 178

• Manufacturer Part Number: DSPIC30F4011-20E/PT
• Description: IC DSPIC MCU/DSP 48K 44TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F4011-20E/PT

• Program Memory Type: FLASH
• Program Memory Size: 48KB (16K x 24)
• Package / Case: 44-TQFP, 44-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 30
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 30
• Data Ram Size: 2 KB
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Data Rom Size: 1024 B
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 44TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 9-chx10-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC30F006 - MODULE SKT FOR DSPIC30F 44TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F401120EPT

dsPIC30F4011/4012
24.1
TABLE 24-1:
TABLE 24-2:
TABLE 24-3:
DS70135G-page 178
dsPIC30F401X-30I
dsPIC30F401X-20E
Power Dissipation:
Internal Chip Power Dissipation:
P
I/O Pin power dissipation:
P
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin SOIC (SO)
Package Thermal Resistance, 40-pin PDIP (P)
Package Thermal Resistance, 44-pin TQFP, 10x10x1 mm (PT)
Package Thermal Resistance, 44-pin QFN (ML)
Note 1:
INT
I
/
O
= ∑ ({V
= V
V
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
DD X
Junction to ambient thermal resistance, Theta-ja (θ
DD
Range
(I
– V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
OH
– ∑ I
}
X
OH
I
OH
)
Characteristic
) + ∑ (V
Rating
-40°C to +125°C
-40°C to +125°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Temp Range
OL X
I
OL
)
dsPIC30F401X-30I
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
—
20
—
10
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
-40
-40
-40
-40
41
45
37
40
28
(T
© 2010 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
dsPIC30F401X-20E
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
20
15
—
—
—
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1