DSPIC30F2023-30I/ML Microchip Technology, DSPIC30F2023-30I/ML Datasheet - Page 13

IC DSPIC MCU/DSP 12K 44QFN

DSPIC30F2023-30I/ML

Manufacturer Part Number
DSPIC30F2023-30I/ML
Description
IC DSPIC MCU/DSP 12K 44QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F2023-30I/ML

Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Core Frequency
30MHz
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
35
Flash Memory Size
12KB
Supply Voltage Range
3V To 5.5V
Operating Temperature Range
-40°C To +85°C
Package
44QFN EP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
35
Interface Type
I2C/SPI/UART
On-chip Adc
12-chx10-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2023-30I/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
6.0
6.1
Memory is erased by using an ERASEB or ERASEP
command, as detailed in
Descriptions”. Code memory can be erased by row
using the ERASEP command. When memory is erased,
the affected memory locations are set to ‘1’s.
The ERASEB command provides several Bulk Erase
options. Performing a Chip Erase with the ERASEB
command clears all code memory and code protection
registers. Alternatively, the ERASEB command can be
used to selectively erase individual program memory
segments.Table 6-1
TABLE 6-1:
6.2
Instead of bulk-erasing the device before starting to
program, it is possible that you may want to modify only
a section of an already programmed device. In this
situation, Chip Erase is not a realistic option.
Instead, you can erase selective rows of code memory
using the ERASEP command. You can then reprogram
the modified rows with the PROGP command pairs.
In these cases, when code memory is programmed,
single-panel programming must be specified in the
PROGP command.
For modification of code-protect bits, the entire chip
must first be erased with the ERASEB command. The
code-protect bits can be reprogrammed using the
PROGC command.
© 2010 Microchip Technology Inc.
ERASEB
ERASEP
Note 1:
Command
Note:
2:
(2)
OTHER PROGRAMMING
FEATURES
Erasing Memory
Modifying Memory
The system operation Configuration
registers and device ID registers are not
erasable.
ERASEP cannot be used to erase
code-protect Configuration bits. These bits
must be erased using ERASEB.
If read or write code protection is enabled,
no modifications can be made to any
region of code memory until code
protection is disabled. Code protection
can only be disabled by performing a Chip
Erase with the ERASEB command.
Entire chip
Specified rows of code memory
ERASE OPTIONS
summarizes the Erase options.
(1)
Affected Region
or all code memory
Section 8.5 “Command
6.3
The READD command reads the Configuration bits and
device ID of the device. This command only returns
16-bit data and operates on 16-bit registers.
The READP command reads the code memory of the
device. This command only returns 24-bit data packed
as described in
The READP command can be used to read up to 32K
instruction words of code memory (only 4K instruction
words are present on the dsPIC30F SMPS devices).
6.4
At times, it may be necessary to determine the version
of programming executive stored in executive memory.
The QVER command performs this function. See
Section 8.5.9 “QVER Command”
command.
Note:
Reading Memory
Programming Executive Software
Version
Reading an unimplemented memory
location
executive to reset. All READD and READP
commands must specify only valid
memory locations.
Section 8.3 “Packed Data
causes
the
for details of QVER
DS70284C-page 13
programming
Format”.

Related parts for DSPIC30F2023-30I/ML