DSPIC30F2023-30I/ML Microchip Technology, DSPIC30F2023-30I/ML Datasheet - Page 46
DSPIC30F2023-30I/ML
Manufacturer Part Number
DSPIC30F2023-30I/ML
Description
IC DSPIC MCU/DSP 12K 44QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DM300023.pdf
(22 pages)
3.DM300023.pdf
(18 pages)
4.DSPIC30F2011-20ISO.pdf
(66 pages)
5.DSPIC30F2011-20IP.pdf
(26 pages)
6.DSPIC30F1010-30ISO.pdf
(26 pages)
7.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F2023-30I/ML
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Core Frequency
30MHz
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
35
Flash Memory Size
12KB
Supply Voltage Range
3V To 5.5V
Operating Temperature Range
-40°C To +85°C
Package
44QFN EP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
35
Interface Type
I2C/SPI/UART
On-chip Adc
12-chx10-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2023-30I/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
TABLE 13-1:
DS70284C-page 46
AC/DC Characteristics
P11
P12
P13
P14
P15
P16
P17
P18a
P18b
P19a
P19b
Param.
No.
T
T
T
T
T
T
T
T
Tprog
T
T
ERA
ERA
DLY
R
VALID
DLY
HLD
KEY
KEY
PROG
Sym
7
8
3
1
2
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS (CONTINUED)
Delay to allow Bulk Erase to Occur
MCLR Rise Time to Enter ICSP™ mode
Data Out Valid from PGC ↑
Delay between Last PGC ↓ and MCLR ↓
MCLR ↓ to V
Delay from First MCLR ↓ to First PGC ↑
for Key Sequence on PGD
Delay from Last PGC ↓ for Key Sequence
on PGD to Second MCLR ↑
Row Programming cycle time
Row programming cycle time
Bulk/Row Erase cycle time
Bulk/Row Erase cycle time
DD
Characteristic
↓
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
Min
200
0.8
0.8
10
40
40
—
—
0
1
1
Max
100
1.0
2.6
2.6
—
—
—
—
—
4
4
© 2010 Microchip Technology Inc.
Units
ms
ms
ms
ms
ms
ms
ns
ns
ns
ns
s
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
Conditions
—
—
—
—
—
—
—