LPC3180FEL320,551 NXP Semiconductors, LPC3180FEL320,551 Datasheet - Page 27

• Manufacturer Part Number: LPC3180FEL320,551
• Description: IC ARM9 MCU 208MHZ 320-LFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3180FEL320,551

• Program Memory Type: ROMless
• Package / Case: 320-LFBGA
• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 208MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, UART/USART, USB OTG
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 55
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.3 V
• Data Converters: A/D 3x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC31
• Core: ARM926EJ-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 64 KB
• Interface Type: I2C/SPI/UART/USB
• Maximum Clock Frequency: 208 MHz
• Number Of Programmable I/os: 55
• Number Of Timers: 2
• Operating Supply Voltage: 3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, LPC3180-DEV-KIT
• Development Tools By Supplier: OM10096
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 3-ch x 10-bit
• Package: 320LFBGA
• Device Core: ARM926EJ-S
• Family Name: LPC3100
• Maximum Speed: 208 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1018 - EVAL KIT FOR LP3180568-4063 - KIT DEV LPC3180568-4062 - DEBUGGER J-LINK JTAG568-4061 - DEBUGGER U-LINK2 JTAG FOR NXP
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935281874551; LPC3180FEL320-S; LPC3180FEL320-S

NXP Semiconductors
7. Limiting values
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
LPC3180_01_1
Preliminary data sheet
Symbol
V
V
V
V
V
V
I
I
T
P
V
DD
SS
stg
DD(1V2)
DD(1V8)
DDA(3V3)
DD
IA
I
tot(pack)
esd
The following applies to
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
Core, PLL, oscillator, and RTC supplies; applies to pins VDD_CORE12_01 to VDD_CORE12_08, VDD_COREFXD12_01 to
VDD_COREFXD12_02, VDD_OSC12, VDD_PLL397_12, VDD_PLLHCLK_12, VDD_PLLUSB_12, VDD_RTC12, VDD_RTCCORE12,
VDD_RTCOSC12, and VDD12.
I/O pad supply; applies to pins VDD_RAM.
Applies to VDD_AD28 pins.
Applies to pins VDD_IOA, VDD_IOB, VDD_IOC and VDD_IOD.
Including voltage on outputs in 3-state mode.
Based on package (LFBGA320) heat transfer, not device power consumption
- calculated Pkg Thermal Resistance (Theta
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
Charge device model per AEC-Q100-011.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
otherwise noted.
Parameter
supply voltage (1.2 V)
supply voltage (1.8 V)
analog supply voltage (3.3 V)
supply voltage
analog input voltage
input voltage
supply current
ground current
storage temperature
total power dissipation
(per package)
electrostatic discharge voltage
Limiting values for LPC3180/01
Table
4:
JA
): 42.407 °C/W ( with JEDEC Test Board (4.5" x 4.0") and 0 m/s airflow, ±15% accuracy)
Rev. 00.08 — 20 November 2008
16/32-bit ARM microcontroller with external memory interface
1.8 V pins
per supply pin
per ground pin
HBM
Conditions
3.3 V pins
Max. Junction Temp 125 °C
Max. Ambient Temp 85 °C
CDM
[1]
[2]
[3]
[4]
[5]
[6]
[6]
[7]
[8]
[9]
LPC3180/01
Min
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
-
-
−40
© NXP B.V. 2008. All rights reserved.
Max
+1.4
+2.4
+4.6
+4.6
+4.6
+2.4
+4.6
100
100
+125
0.94
+2000
+500
SS
unless
27 of 56
Unit
V
V
V
V
V
V
V
mA
mA
°C
W
V
V