ST7FLITE39F2M6 STMicroelectronics, ST7FLITE39F2M6 Datasheet - Page 160
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ST7FLITE39F2M6
Manufacturer Part Number
ST7FLITE39F2M6
Description
IC MCU 8BIT 8K FLASH 20SOIC
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST7FLITE35F2M6TR.pdf
(173 pages)
Specifications of ST7FLITE39F2M6
Core Processor
ST7
Core Size
8-Bit
Speed
16MHz
Connectivity
LINSCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
15
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SOIC (7.5mm Width)
Processor Series
ST7FLITE3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
LINSCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
15
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7FLITE-SK/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 7 Channel
For Use With
497-8406 - BOARD STF20NM50FD/STF7LITE39BF2497-8403 - BOARD DEMO STCC08 AC SW DETECTOR497-6398 - BOARD EVAL ST7FLITE39/STM1403497-5858 - EVAL BOARD PLAYBACK ST7FLITE497-5514 - EVAL BOARD THERMO CONTROL REFRIG497-5049 - KIT STARTER RAISONANCE ST7FLITE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-5641-5
STFLITE39F2M6
STFLITE39F2M6
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
ST7LITE3xF2
Figure 107. 20-Pin Plastic Dual In-Line Package, 300-mil Width
14.2 THERMAL CHARACTERISTICS
Notes:
1.
2.
tion of an application is defined by the user with the formula: P
internal power (I
application.
160/173
D1
The maximum chip-junction temperature is based on technology characteristics.
The maximum power dissipation is obtained from the formula P
Symbol
P
20
T
1
R
Dmax
Jmax
thJA
b
DD
Package thermal resistance
(junction to ambient)
Maximum junction temperature
Maximum power dissipation
x V
D
DD
) and P
b2
PORT
e
10
11
Ratings
is the port power dissipation depending on the ports used in the
A2
A1
2)
E1
1)
A
L
eB
c
DIP20
SO20
DIP20
SO20
D
Note 1. Values in inches are converted from mm and
rounded to 4 decimal digits.
Dim.
D
A1
A2
D1
eB
b2
E1
= P
A
D
N
b
c
e
L
= (T
INT
24.89 26.16 26.92 0.9799 1.0299 1.0598
0.38
2.92 3.30 4.95 0.1150 0.1299 0.1949
0.36 0.46 0.56 0.0142 0.0181 0.0220
1.14 1.52 1.78 0.0449 0.0598 0.0701
0.20 0.25 0.36 0.0079 0.0098 0.0142
0.13
6.10 6.35 7.11 0.2402 0.2500 0.2799
2.92 3.30 3.81 0.1150 0.1299 0.1500
Min
J
+ P
-T
A
2.54
mm
Typ
Value
PORT
) / R
150
400
330
63
76
10.92
Max
5.33
Number of Pins
thJA
where P
. The power dissipa-
0.0150
0.0051
20
Min
INT
inches
0.1000
Typ
°C/W
Unit
mW
°C
is the chip
1)
0.2098
0.4299
Max