STM32F102C8T6TR STMicroelectronics, STM32F102C8T6TR Datasheet - Page 27

MCU 32BIT ARM 64K FLASH 48-LQFP

STM32F102C8T6TR

Manufacturer Part Number
STM32F102C8T6TR
Description
MCU 32BIT ARM 64K FLASH 48-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F102C8T6TR

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
48MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
Processor Series
STM32F102x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
10 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
37
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
For Use With
497-10030 - STARTER KIT FOR STM32497-6438 - BOARD EVALUTION FOR STM32 512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STM32F102C8T6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F102C8T6TR
Manufacturer:
ST
0
STM32F102x8, STM32F102xB
5.3
5.3.1
5.3.2
Operating conditions
General operating conditions
Table 8.
1. When the ADC is used, refer to
2. It is recommended to power V
3. If T
4. In low power dissipation state, T
Operating conditions at power-up / power-down
Subject to general operating conditions for T
Table 9.
Symbol
Symbol
V
between V
characteristics on page
Table 6.2: Thermal characteristics on page
f
f
t
f
PCLK1
PCLK2
V
VDD
DDA
HCLK
V
P
T
T
BAT
DD
A
A
D
J
is lower, higher P
(1)
V
V
DD
General operating conditions
Operating conditions at power-up / power-down
DD
DD
Internal APB1 clock frequency
Internal APB2 clock frequency
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Power dissipation at T
85 °C
Ambient temperature
Junction temperature range
Internal AHB clock frequency
and V
Standard operating voltage
Backup operating voltage
rise time rate
fall time rate
Parameter
(3)
DDA
D
Parameter
65).
can be tolerated during power-up and operation.
values are allowed as long as T
DD
A
Table 44: ADC
and V
can be extended to this range as long as T
Doc ID 15056 Rev 3
A
=
DDA
65).
from the same source. A maximum difference of 300 mV
characteristics.
Must be the same potential
as V
LQFP48
LQFP64
Maximum power dissipation
Low power dissipation
A
Conditions
.
DD
J
(2)
does not exceed T
Conditions
(4)
J
J
max (see
Electrical characteristics
does not exceed T
Min
Min
–40
20
–40
–40
2.4
1.8
0
0
0
0
2
2
Table 6.2: Thermal
Max
363
444
105
105
3.6
3.6
3.6
3.6
48
24
48
85
Max
J
max (see
MHz
Unit
mW
°C
°C
°C
Unit
µs/V
V
V
V
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