ST72F321AR6T6 STMicroelectronics, ST72F321AR6T6 Datasheet - Page 192

MCU 8BIT 32KB FLASH 64TQFP

ST72F321AR6T6

Manufacturer Part Number
ST72F321AR6T6
Description
MCU 8BIT 32KB FLASH 64TQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet

Specifications of ST72F321AR6T6

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
48
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TQFP, 64-VQFP
Processor Series
ST72F3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
1024 B
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
48
Number Of Timers
5
Operating Supply Voltage
3.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7F521-IND/USB, ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, ST7MDT20M-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-4842

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16 REVISION HISTORY
Table 32. Revision History
13-Mar-2009
18-Oct-2004
Date
Revision
1.10
2
Added “related documentation” section in specific chapters throughout document
Flash readout protection sentence added
I
Vt POR max modified in
Added
Modified description of t
Added Note on PE2 pin in Table 2, “Device Pin Description,” on page 10
Modified V
Modified I
Updated ADC accuracy data and notes in
ITATIONS” on page 186
Added
I2C multimaster bug added in Known Limitations,
Please read carefully the
Updated root part numbers and device summary table on coverpage.
Removed temperature ranges 1, 5, and 7.
Renamed all TQFP packages, LQFP.
Updated note 6 below Table 2, “Device Pin Description,” on page 10.
Updated data retention in “Features” and
Updated
Updated
Added
Modified
Update Note 4 in
tics” .
Updated notes in
Removed recommended wave soldering profile and recommended reflow soldering oven
profile, and added ECOPACK text in
page 174 (Section
Removed automotive temperature ranges from
tions, and from
Section 14.2 “DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER
CODE” on page 177:
Added
with LVD inSection 15 KNOWN
neously with OC interrupt” on page 189.
2
C Chapter updated,
Figure 89 on page 160
“Clearing active interrupts outside interrupt routine” on page 187
Section 10.8.3.3 “Changing the conversion channel” on page
Section 15.1.5 External interrupt
Figure 50
Figure 94
“Absolute Maximum Ratings (Electrical Sensitivity)” on page
INJ
AREF
for PC6 in
Figure 106
min in
Section 12.8 I/O PORT PIN CHARACTERISTICS
Section 13.2 THERMAL
13.3).
“Output Compare Timing Diagram, fTIMER = fCPU/4” .
“SPI Master Timing Diagram 1)” .
replace list or order codes by ordering scheme.
(Section
“10-BIT ADC CHARACTERISTICS” on page 167
w(RSTL)out
Section 12.8
section 12.4 on page 142
“ROM Factory Coded Device Types” and option list. Modified
“KNOWN LIMITATIONS” on page 186
10.7)
LIMITATIONS. Modified
Description of Changes
in
“SOLDERING AND GLUEABILITY INFORMATION” on
“Asynchronous RESET Pin” on page 159
missed, and
ST72321Rx ST72321ARx ST72321Jx
Section 12.6.2 FLASH
section 4.3.1 on page 18
section 12.12.3 on page 170
CHARACTERISTICS.
Section 12.3.1 General Operating Condi-
Section 15.1.10
Section 15.2.1 Internal RC Oscillator
Section 15.1.9 “TIMD set simulta-
Memory.
“General Characteris-
129.
155.
and
“KNOWN LIM-
192/193

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