STM32F103RDT6 STMicroelectronics, STM32F103RDT6 Datasheet - Page 100

MCU ARM 32BIT 384KB FLASH 64LQFP

STM32F103RDT6

Manufacturer Part Number
STM32F103RDT6
Description
MCU ARM 32BIT 384KB FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F103RDT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
3 (12 bit, 16 Channel)
On-chip Dac
2 (12 bit, 2 Channel)
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
64KB
# I/os (max)
51
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Electrical characteristics
100/123
Table 61.
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-
4. Based on characterization, not tested in production.
Figure 53. ADC accuracy characteristics
Symbol
4095
4094
4093
robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to
standard analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
EO
EG
ED
ET
EL
7
6
5
4
3
2
1
0
V
SSA
[1LSB
1
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
E
IDEAL
O
ADC accuracy
2
=
V
4096
3
REF+
Parameter
4
(or
V
5
1 LSB
4096
DDA
E
(1) (2)(3)
6
T
depending on package)]
IDEAL
Doc ID 14611 Rev 7
E
7
L
(2)
f
f
V
Measurements made after
ADC calibration
PCLK2
ADC
E
DDA
D
4093 4094 4095 4096
= 14 MHz, R
(3)
= 2.4 V to 3.6 V
STM32F103xC, STM32F103xD, STM32F103xE
= 56 MHz,
Test conditions
DD
(1)
, frequency, V
INJ(PIN)
E
G
V
AIN
DDA
and I
< 10 k,
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
T
O
G
D
L
REF
=Total Unadjusted Error: maximum deviation
=Integral Linearity Error: maximum deviation
=Differential Linearity Error: maximum deviation
=Offset Error: deviation between the first actual
=Gain Error: deviation between the last ideal
INJ(PIN)
and temperature ranges.
in
±1.5
±1.5
±1.5
Typ
±2
±1
Section 5.3.13
Max
±2.5
±3
±2
±5
±3
(4)
does not
Unit
LSB
ai14395b

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