MC9S08MP16VLF Freescale Semiconductor, MC9S08MP16VLF Datasheet - Page 10

• Manufacturer Part Number: MC9S08MP16VLF
• Description: MCU 8BIT .25U SGF FLASH 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08MP16VLF

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 51.34MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 40
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 13x12b, D/A 3x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 48-LQFP
• Processor Series: S08MP
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SCI
• Maximum Clock Frequency: 51.34 MHz
• Number Of Programmable I/os: 40
• Number Of Timers: 2
• Operating Supply Voltage: - 0.3 V to + 5.8 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08MP16
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 13 Channel
• On-chip Dac: 3 DAC, 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Electrical Characteristics
2.4
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take P
the difference between actual pin voltage and V
unusually high pin current (heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
is:
Solving
10
1
2
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Junction-to-ambient natural convection
Num
1
2
3
4
Equation 1
T
θ
P
P
P
JA
A
D
int
I/O
Thermal Characteristics
—
= Ambient temperature, °C
= P
D
D
D
C
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
int
DD
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance
single-layer board
Thermal resistance
four-layer board
+ P
× V
and
I/O
DD
I/O
Equation 2
, Watts — chip internal power
<< P
48-pin LQFP
32-pin LQFP
28-pin SOIC
48-pin LQFP
32-pin LQFP
28-pin SOIC
int
and can be neglected. An approximate relationship between P
Rating
for K gives:
1,2
1,2
K = P
J
MC9S08MP16 Series Data Sheet, Rev. 1
) in °C can be obtained from:
Table 4. Thermal Characteristics
D
P
SS
T
× (T
D
J
or V
= K ÷ (T
= T
A
+ 273°C) + θ
A
DD
+ (P
and multiply by the pin current for each I/O pin. Except in cases of
J
+ 273°C)
D
Symbol
× θ
θ
θ
T
T
JA
JA
JA
A
J
JA
)
× (P
D
I/O
)
Consumer &
2
–40 to 105
Industrial
into account in power calculations, determine
115
SS
80
85
71
56
57
48
or V
DD
will be very small.
D
and T
Automotive
–40 to 125
Freescale Semiconductor
135
J
80
56
—
—
—
—
(if P
I/O
is neglected)
°C/W
°C/W
Unit
Eqn. 1
Eqn. 2
Eqn. 3
°C
°C