MC9S08MP16VLF Freescale Semiconductor, MC9S08MP16VLF Datasheet - Page 2

MCU 8BIT .25U SGF FLASH 48-LQFP

MC9S08MP16VLF

Manufacturer Part Number
MC9S08MP16VLF
Description
MCU 8BIT .25U SGF FLASH 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08MP16VLF

Core Processor
HCS08
Core Size
8-Bit
Speed
51.34MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
40
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 13x12b, D/A 3x5b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
48-LQFP
Processor Series
S08MP
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SCI
Maximum Clock Frequency
51.34 MHz
Number Of Programmable I/os
40
Number Of Timers
2
Operating Supply Voltage
- 0.3 V to + 5.8 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08MP16
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 13 Channel
On-chip Dac
3 DAC, 5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08MP16VLF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1
2
2
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .23
2.11 Digital to Analog (DAC) Characteristics . . . . . . . . . . . .26
2.12 High Speed Comparator (HSCMP) Characteristics . . .26
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . .9
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . .9
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .10
ESD Protection and Latch-Up Immunity . . . . . . . . . . . .11
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Supply Current Characteristics . . . . . . . . . . . . . . . . . . .15
External Oscillator (XOSC) Characteristics . . . . . . . . .20
Internal Clock Source (ICS) Characteristics . . . . . . . . .21
MC9S08MP16 Series Data Sheet, Rev. 1
Table of Contents
3
4
5
6
2.13 Programmable Gain Amplifier (PGA) Characteristics . 26
2.14 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.15 Flash Memory Specifications. . . . . . . . . . . . . . . . . . . . 33
2.16 EMC Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.1
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Related Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
2.14.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.14.2 FTM Module Timing . . . . . . . . . . . . . . . . . . . . . 28
2.14.3 MTIM Module Timing . . . . . . . . . . . . . . . . . . . . 29
2.14.4 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.16.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . . 33
Device Numbering Scheme. . . . . . . . . . . . . . . . . . . . . 35
Freescale Semiconductor

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