MC9S08GT16ACFBE Freescale Semiconductor, MC9S08GT16ACFBE Datasheet - Page 280
MC9S08GT16ACFBE
Manufacturer Part Number
MC9S08GT16ACFBE
Description
IC MCU 16K FLASH 2K RAM 44-QFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08GT8ACFBER.pdf
(300 pages)
Specifications of MC9S08GT16ACFBE
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFP
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
2KB
# I/os (max)
36
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
PQFP
Processor Series
S08GT
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Operating Supply Voltage
3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
M68EVB908GB60E, M68DEMO908GB60E
Minimum Operating Temperature
- 40 C
For Use With
M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08GT16ACFBE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MC9S08GT16ACFBER
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S08GT16ACFBER
Manufacturer:
NXP/恩智浦
Quantity:
20 000
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Electrical Characteristics
A.10.3
Table A-14
280
No.
10
11
12
1
2
3
4
5
6
7
8
9
Operating frequency
SCK period
Enable lead time
Enable lag time
Clock (SCK) high or low time
Data setup time (inputs)
Data hold time (inputs)
Slave access time
Slave MISO disable time
Data valid (after SCK edge)
Data hold time (outputs)
Rise time
Fall time
Master
Slave
Master
Slave
Master
Slave
Master
Slave
Master
Slave
Master
Slave
Master
Slave
Master
Slave
Master
Slave
Input
Output
Input
Output
and
SPI Timing
Figure A-17
Function
through
MC9S08GT16A/GT8A Data Sheet, Rev. 1
Figure A-20
Table A-14. SPI Timing
describe the timing requirements for the SPI system.
Symbol
t
t
WSCK
t
t
Lead
t
t
SCK
t
t
t
f
Lag
t
t
t
HO
RO
SU
FO
op
t
dis
t
HI
RI
FI
a
v
f
t
t
Bus
cyc
cyc
Min
1/2
1/2
dc
15
15
25
—
—
—
—
—
—
—
—
/2048
2
4
1
1
0
0
0
– 30
– 30
1024 t
t
t
Freescale Semiconductor
cyc
cyc
f
f
2048
Bus
Bus
Max
25
25
25
25
—
—
—
—
—
—
—
—
—
—
—
—
1
1
– 25
– 25
/2
/4
cyc
t
t
Unit
t
t
t
t
t
t
SCK
SCK
Hz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
cyc
cyc
cyc
cyc
cyc
cyc
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