MC9S08GT16ACFBE Freescale Semiconductor, MC9S08GT16ACFBE Datasheet - Page 47

• Manufacturer Part Number: MC9S08GT16ACFBE
• Description: IC MCU 16K FLASH 2K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT16ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 36
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

1
0x1811
0x1812
0x1813
0x1814
0x1815
0x1816
0x1817
0x1818
0x1819–
0x181F
0x1820
0x1821
0x1822
0x1823
0x1824
0x1825
0x1826
0x1827–
0x182B
0xFFB0 –
0xFFB7
0xFFB8 –
0xFFBC
0xFFBD
0xFFBE
0xFFBF
Nonvolatile FLASH registers, shown in
include an 8-byte backdoor key which optionally can be used to gain access to secure memory resources.
During reset events, the contents of NVPROT and NVOPT in the nonvolatile register area of the FLASH
memory are transferred into corresponding FPROT and FOPT working registers in the high-page registers
to control security and block protection options.
Provided the key enable (KEYEN) bit is 1, the 8-byte comparison key can be used to temporarily
disengage memory security. This key mechanism can be accessed only through user code running in secure
memory. (A security key cannot be entered directly through background debug commands.) This security
key can be disabled completely by programming the KEYEN bit to 0. If the security key is disabled, the
Freescale Semiconductor
Address
Address
NVICGTRM is the factory trim value. This value must be copied to ICGTRM in user code.
DBGCAL
DBGCBH
DBGCBL
DBGFH
DBGFL
DBGC
DBGT
DBGS
Reserved
FCDIV
FOPT
Reserved
FCNFG
FPROT
FSTAT
FCMD
Reserved
NVBACKKEY
Reserved
NVPROT
NVICGTRM
NVOPT
Register Name
Register Name
1
TRGSEL
DBGEN
FCMD7
Table 4-3. High-Page Register Summary (continued)
KEYEN
KEYEN
FCBEF
DIVLD
Bit 15
Bit 15
FPS7
FPS7
Bit 7
Bit 7
Bit 7
Bit 7
Bit 7
AF
—
—
—
—
—
—
—
0
Table 4-4. Nonvolatile Register Summary
MC9S08GT16A/GT8A Data Sheet, Rev. 1
FNORED
FNORED
PRDIV8
FCMD6
BEGIN
FCCF
FPS6
FPS6
ARM
BF
14
14
—
—
—
—
—
—
—
6
6
6
6
0
6
Table
KEYACC
4-4, are located in the FLASH memory. These registers
FPVIOL
FCMD5
ARMF
FPS5
FPS5
DIV5
TAG
13
13
—
—
—
—
—
—
—
5
5
5
5
0
0
5
0
8-Byte Comparison Key
FACCERR
BRKEN
FCMD4
FPS4
FPS4
DIV4
12
12
—
—
—
—
—
—
—
4
4
4
4
0
0
0
0
4
0
NVTRIM
FCMD3
TRG3
CNT3
FPS3
FPS3
RWA
DIV3
11
11
—
—
—
—
—
—
—
3
3
3
3
0
0
0
3
0
FBLANK
RWAEN
FCMD2
TRG2
CNT2
FPS2
FPS2
DIV2
10
10
—
—
—
—
—
—
—
2
2
2
2
0
0
2
0
FCMD1
SEC01
SEC01
TRG1
CNT1
FPS1
FPS1
RWB
DIV1
—
—
—
—
—
—
—
1
1
9
1
9
1
0
0
1
RWBEN
FCMD0
SEC00
SEC00
FPDIS
FPDIS
TRG0
CNT0
DIV0
Bit 0
Bit 0
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Memory
—
—
—
—
—
—
—
0
0
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