MC68HC908LK24CFU Freescale Semiconductor, MC68HC908LK24CFU Datasheet - Page 452
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MC68HC908LK24CFU
Manufacturer Part Number
MC68HC908LK24CFU
Description
IC MCU 24K FLASH 8MHZ SPI 64-QFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet
1.MC908LK24CFUE.pdf
(464 pages)
Specifications of MC68HC908LK24CFU
Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, IRSCI, SPI
Peripherals
LCD, LVD, POR, PWM
Number Of I /o
40
Program Memory Size
24KB (24K x 8)
Program Memory Type
FLASH
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC68HC908LK24CFU
Manufacturer:
FREESCALE Semiconductor
Quantity:
489
Company:
Part Number:
MC68HC908LK24CFU
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Mechanical Specifications
25.3 64-Pin Low-Profile Quad Flat Pack (LQFP)
Data Sheet
452
C L
VIEW Y
H
C
3X
SEATING
PLANE
AB
AB
A
A
Figure 25-1. 64-Pin Low-Profile Quad Flat Pack (Case No. 840F)
16
1
4X
VIEW Y
64
17
0.2 H A–B D
D/2
D1/2
X=A, B OR D
X
D1
D
60X
e/2
e
4X
4X
D
( 2)
( 3)
49
32
PLATING
Mechanical Specifications
48
33
4X 16 TIPS
B
E1/2
c
0.2 C A–B D
VIEW AA
ROTATED 90 CLOCKWISE
SECTION AB–AB
E/2
0.08
0.08 C
E1
BASE METAL
M
b1
b
E
C
A–B
D
c1
A1
NOTES:
MC68HC908LJ24/LK24 — Rev. 2.1
A2
1. ALL DIMENSIONING AND TOLERANCING PER
2.
3.
4. DATUMS A, B AND D TO BE DETERMINED AT
5. DIMENSIONS D AND E TO BE DETERMINED AT
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
7. DIMENSION b DOES NOT INCLUDE DAMBAR
VIEW AA
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE H IS COINCIDENT WITH THE
BOTTOM OF THE LEAD WHERE THE LEAD EXITS
THE PLASTIC BODY AT THE BOTTOM OF THE
PARTING LINE.
DATUM PLANE H.
SEATING PLANE C.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
PER SIDE. DIMENSIONS D1 AND E1 DO INCLUDE
MOLD MISMATCH AND ARE DETERMINED AT
DATUM PLANE H.
PROTRUSION. THE DAMBAR PROTRUSION
SHALL NOT CAUSE THE b DIMENSION TO
EXCEED 0.35. MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07.
(S)
0.05
DIM
(L2)
A1
A2
D1
R1
b1
c1
E1
L1
L2
A
b
c
D
e
E
L
S
1
2
3
MILLIMETERS
S
MIN
0.05
1.35
0.17
0.17
0.09
0.09
0.45
0.10
—
0
0
12.00 BSC
10.00 BSC
12.00 BSC
10.00 BSC
1.00 REF
0.50 REF
12 REF
12 REF
0.20 REF
0.50 BSC
Freescale Semiconductor
(L)
1.60
0.15
1.45
0.27
0.23
0.20
0.16
0.75
0.20
MAX
L
—
7
1
GAGE PLANE
2X R
0.25
R1
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