MC68HC705C8AFNE Freescale Semiconductor, MC68HC705C8AFNE Datasheet - Page 35

IC MCU 8BIT 44-PLCC

MC68HC705C8AFNE

Manufacturer Part Number
MC68HC705C8AFNE
Description
IC MCU 8BIT 44-PLCC
Manufacturer
Freescale Semiconductor
Series
HC05r
Datasheet

Specifications of MC68HC705C8AFNE

Core Processor
HC05
Core Size
8-Bit
Speed
2.1MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
24
Program Memory Size
8KB (8K x 8)
Program Memory Type
OTP
Ram Size
304 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
44-PLCC
Processor Series
HC705C
Core
HC05
Data Bus Width
8 bit
Data Ram Size
304 B
Interface Type
SCI, SPI
Maximum Clock Frequency
2.1 MHz
Number Of Programmable I/os
24
Number Of Timers
1
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68HC705C8AFNE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
2.1 Contents
2.2 Introduction
2.3 Memory Map
MC68HC705C8A — Rev. 3
MOTOROLA
Technical Data — MC68HC705C8A
2.2
2.3
2.4
2.5
2.6
2.7
This section describes the organization of the on-chip memory.
The central processor unit (CPU) can address eight Kbytes of memory
and input/output (I/O) registers. The program counter typically advances
one address at a time through memory, reading the program instructions
and data. The programmable read-only memory (PROM) portion of
memory — either one-time programmable read-only memory
(OTPROM) or erasable, programmable read-only memory
(EPROM) — holds the program instructions, fixed data, user-defined
vectors, and interrupt service routines. The random-access memory
(RAM) portion of memory holds variable data.
I/O registers are memory-mapped so that the CPU can access their
locations in the same way that it accesses all other memory locations.
The shared stack area is used during processing of an interrupt or
Freescale Semiconductor, Inc.
For More Information On This Product,
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Input/Output (I/O) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
EPROM/OTPROM (PROM) . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Bootloader ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Go to: www.freescale.com
Memory
Section 2. Memory
Technical Data

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