MC68HC16Z1CAG25 Freescale Semiconductor, MC68HC16Z1CAG25 Datasheet - Page 360

• Manufacturer Part Number: MC68HC16Z1CAG25
• Description: IC MCU 16BIT 25MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC16r

Specifications of MC68HC16Z1CAG25

• Core Processor: CPU16
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: ROMless
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Cpu Family: HC16
• Device Core Size: 16b
• Frequency (max): 25MHz
• Interface Type: SCI/SPI/UART
• Program Memory Size: Not Required
• Total Internal Ram Size: 1KB
• # I/os (max): 16
• Number Of Timers - General Purpose: 11
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Controller Family/series: 68HC16
• No. Of I/o's: 16
• Ram Memory Size: 1KB
• Cpu Speed: 25MHz
• No. Of Timers: 2
• Embedded Interface Type: QSPI, SCI
• Rohs Compliant: Yes
• Processor Series: HC16Z
• Core: CPU16
• Data Bus Width: 16 bit
• Data Ram Size: 1 KB
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 11
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

VIEW AB
C
B-4
C2
L
18
50
C1
17
51
0.002 N
0.012
0.010
Figure B-3 Case 831A-01 — 132-Pin Package Dimensions
0.016
132X
A1
S1
H
T
1
0.008
H
2X
D
L–M
L–M
L–M
J
N
M
N
A
MECHANICAL DATA AND ORDERING INFORMATION
N
4X
T
S
4X 33 TIPS
L–M
4X
Freescale Semiconductor, Inc.
SECTION AA–AA
N
For More Information On This Product,
J1
N
AA
PIN 1
IDENT
132X
0.008
U
D1
117
83
M
Go to: www.freescale.com
T
116
84
AA
L–M
M
R
K
P1
R1
N
W
T
0.004 T
P
H
0.002 L–M
SEATING
PLANE
V1
K1
q
V
132X
B1
GAGE
PLANE
B
2X
NOTES:
METAL
BASE
1. DIMENSIONING AND TOLERANCING PER ASME
2. DIMENSIONS IN INCHES.
3. DIMENSIONS A, B, J, AND P DO NOT INCLUDE
4. DATUM PLANE H IS LOCATED AT THE UNDERSIDE
5. DATUMS L, M, AND N TO BE DETERMINED WHERE
6. DIMENSIONS S AND V TO BE DETERMINED AT
7. DIMENSIONS A, B, J, AND P TO BE DETERMINED AT
8. DIMENSION F DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
MOLD PROTRUSION. ALLOWABLE MOLD
PROTRUSION FOR DIMENSIONS A AND B IS 0.007,
FOR DIMENSIONS J AND P IS 0.010.
OF LEADS WHERE LEADS EXIT PACKAGE BODY.
CENTER LEADS EXIT PACKAGE BODY AT DATUM H.
SEATING PLANE, DATUM T.
DATUM PLANE H.
PROTRUSIONS. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.019.
AC AC
DIM
A1
B1
C1
C2
D1
D2
E1
K1
P1
R1
S1
V1
J1
W
A
B
C
D
E
G
K
P
S
U
V
E
F
J
q
Í Í Í Í
Í Í Í Í
Í Í Í Í
0.160
0.020
0.135
0.008
0.012
0.008
0.006
0.005
0.014
0.034
0.006
SECTION AC–AC
MIN
1.100 BSC
0.550 BSC
1.100 BSC
0.550 BSC
0.025 BSC
0.950 BSC
0.475 BSC
0.010 BSC
0.950 BSC
0.475 BSC
0.013 REF
1.080 BSC
0.540 BSC
0.025 REF
1.080 BSC
0.540 BSC
0
INCHES
Ç Ç Ç
Ç Ç Ç
_
VIEW AB
0.180
0.040
0.145
0.012
0.016
0.008
0.007
0.014
0.044
0.008
0.011
MAX
(D)
D2
8
C L
M68HC16 Z SERIES
_
USER’S MANUAL
128X
X=L, M, OR N
X
G
E1
PLATING