HD6417020SVX12IV Renesas Electronics America, HD6417020SVX12IV Datasheet - Page 154

MCU 3/5V 0K PB-FREE 100-TQFP

HD6417020SVX12IV

Manufacturer Part Number
HD6417020SVX12IV
Description
MCU 3/5V 0K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7020r
Datasheet

Specifications of HD6417020SVX12IV

Core Processor
SH-1
Core Size
32-Bit
Speed
12.5MHz
Connectivity
EBI/EMI, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
32
Program Memory Type
ROMless
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

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Manufacturer
Quantity
Price
Part Number:
HD6417020SVX12IV
Manufacturer:
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Quantity:
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Part Number:
HD6417020SVX12IV
Manufacturer:
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Quantity:
10 000
8.5
When the DRAM enable bit (DRAME) of the BCR is set to 1, area 1 becomes DRAM space and
the DRAM interface function is available, which permits direct connection of this LSI to DRAMs.
8.5.1
When the multiplex enable bit (MXE) of the DRAM area control register (DCR) is set to 1, row
addresses and column addresses are multiplexed. This allows DRAMs that require multiplexing of
row and column addresses to be connected directly to the SH microprocessors without additional
multiplexing circuits. When addresses are multiplexed (MXE = 1), setting of the DCR’s multiplex
shift bits (MXC1, MXC0) allows selection of eight, nine and ten-bit row address shifting. Table
8.9 illustrates the relationship between MXC1/MXC0 bits and address multiplexing.
134 RENESAS
DRAM Interface Operation
DRAM Address Multiplexing

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