DF2110BVTE10 Renesas Electronics America, DF2110BVTE10 Datasheet - Page 555

• Manufacturer Part Number: DF2110BVTE10
• Description: MCU 3V 64K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2110BVTE10

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 10MHz
• Connectivity: Host Interface (LPC), I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 82
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2110BVTE10; HD64F2110BVTE10

14-Bit PWM Timer (PWMX)................. 131
16-Bit Count Mode ................................. 197
16-Bit Free-Running Timer (FRT) ......... 147
8-Bit Timer (TMR) ................................. 173
A20 Gate................................................. 393
ABRKCR.................. 67, 462, 468, 474, 480
Absolute Address...................................... 39
Address Map............................................. 55
Address Space........................................... 19
Addressing Modes .................................... 38
Arithmetic Operations Instructions........... 30
Asynchronous Mode............................... 237
BAR .......................... 67, 462, 468, 474, 480
Bcc ............................................................ 35
BCR .......................... 89, 465, 471, 477, 483
Bit Manipulation Instructions ................... 33
bit rate ..................................................... 232
Block Data Transfer Instructions.............. 37
Boot Mode .............................................. 420
Branch Instructions................................... 35
Break....................................................... 263
BRR ........................................................ 232
Buffered Input Capture Input.................. 162
Cascaded Connection.............................. 197
Clear Timing........................................... 161
Clock Pulse Generator ............................ 433
Clocked Synchronous Mode................... 254
CMI......................................................... 201
CMIA...................................................... 201
CMIAY................................................... 201
CMIB ...................................................... 201
CMIBY ................................................... 201
Compare-Match Count Mode ................. 197
Condition field .......................................... 37
Index
Condition-Code Register (CCR) ...............22
Crystal Resonator....................................434
DACNT................... 133, 464, 470, 476, 482
DACR ..................... 136, 464, 470, 476, 482
Data Transfer Instructions.........................29
DDCSWR ............... 292, 462, 468, 474, 480
Direct Transitions....................................456
EBR1....................... 418, 462, 469, 475, 481
EBR2....................... 418, 462, 469, 475, 481
EEPMOV Instruction................................48
Effective Address......................................42
Effective address extension.......................37
Erase/Erase-Verify ..................................427
erasing units ............................................414
ERRI .......................................................403
Error Protection.......................................429
Exception Handling ..................................57
Exception Vector Table ............................58
Extended Control Register (EXR) ............22
flash memory ..........................................409
FLMCR1 ................. 416, 462, 469, 475, 481
FLMCR2 ................. 417, 462, 469, 475, 481
FOV ........................................................166
framing error ...........................................244
FRC......................... 150, 463, 469, 475, 481
General Registers ......................................21
Hardware Protection ...............................429
Hardware Standby Mode ........................452
HICR0 ..................... 361, 461, 468, 474, 480
HICR1 ..................... 361, 461, 468, 474, 480
HICR2 ..................... 368, 461, 468, 474, 480
HICR3 ..................... 368, 461, 468, 474, 480
HISEL ..................... 389, 461, 468, 474, 480
Rev. 2.00 Mar 21, 2006 page 515 of 518