MC68HC711E9MFNE2 Freescale Semiconductor, MC68HC711E9MFNE2 Datasheet - Page 184
MC68HC711E9MFNE2
Manufacturer Part Number
MC68HC711E9MFNE2
Description
IC MCU 8BIT 512BYTES ROM 52-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Specifications of MC68HC711E9MFNE2
Core Processor
HC11
Core Size
8-Bit
Speed
2MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Size
12KB (12K x 8)
Program Memory Type
OTP
Eeprom Size
512 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
52-PLCC
Processor Series
HC711E
Core
HC11
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SCI, SPI
Maximum Clock Frequency
2 MHz
Number Of Programmable I/os
38
Number Of Timers
8
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC68HC711E9MFNE2
Manufacturer:
TI
Quantity:
167
Company:
Part Number:
MC68HC711E9MFNE2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Ordering Information and Mechanical Specifications
11.7 64-Pin Quad Flat Pack (Case 840C)
184
L
C
H
E
49
64
G
48
1
0.20 (0.008)
0.05 (0.002) A–B
0.20 (0.008)
–D–
DETAIL C
M
M
M
M
DETAIL C
A
S
L
H
C
DETAIL A
A–B
A–B
X
M68HC11E Family Data Sheet, Rev. 5.1
K
S
S
U
D
D
S
S
Q
T
33
16
R
32
17
SEATING PLANE
–C–
B
–H–
0.10 (0.004)
SEATING PLANE
DATUM PLANE
V
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS A–B AND –D– TO BE DETERMINED AT
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. DIMENSION K IS TO BE MEASURED FROM THE
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DATUM PLANE –H–.
SEATING PLANE –C–.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED 0.53
(0.021). DAMBAR CANNOT BE LOCATED ON THE
LOWER RADIUS OR THE FOOT.
THEORETICAL INTERSECTION OF LEAD FOOT
AND LEG CENTERLINES.
DIM
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
U
V
X
F
J
L
T
0.20 (0.008)
B
J
13.90
13.90
0.067
0.130
0.130
16.20
16.20
MILLIMETERS
MIN
2.07
0.30
2.00
0.30
0.50
0.13
1.10
12.00 REF
0.80 BSC
5
0.40 BSC
2
0.20 REF
0
Ç Ç Ç Ç
É É É É
Ç Ç Ç Ç
É É É É
Ç Ç Ç Ç
SECTION B–B
DETAIL A
14.10
14.10
0.250
0.230
0.170
16.60
16.60
MAX
Freescale Semiconductor
2.46
0.45
2.40
0.66
0.30
1.30
–––
10
–––
8
M
F
D
C
0.547
0.547
0.081
0.012
0.079
0.012
0.003
0.005
0.020
0.005
0.005
0.638
0.638
0.043
MIN
0.031 BSC
0.472 REF
0.016 BSC
0.008 REF
A–B
5
2
0
INCHES
–A–, –B–, –D–
P
MAX
0.555
0.555
0.097
0.018
0.094
0.010
0.090
0.026
0.007
0.012
0.654
0.654
0.051
S
–––
10
–––
8
BASE
METAL
N
D
S
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