MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 557

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

14.2
Due to the nature of VREG_3V3 being a voltage regulator providing the chip internal power supply
voltages, most signals are power supply signals connected to pads.
14.2.1
Signal V
this pin. A chip external decoupling capacitor (>=100 nF, X7R ceramic) between V
is not available V
For entering Shutdown Mode, pin V
14.2.2
Signals V
regulator. Internal precision reference circuits are supplied from these signals. A chip external decoupling
capacitor (>=100 nF, X7R ceramic) between V
supply.
14.2.3
Signals V
These signals are connected to device pins to allow external decoupling capacitors (220 nF, X7R ceramic).
In Shutdown Mode an external supply driving V
Freescale Semiconductor
Table 14-1
DDR
External Signal Description
DDA
DD
shows all signals of VREG_3V3 associated with pins.
VDDR — Regulator Power Input Pins
VDDA, VSSA — Regulator Reference Supply Pins
VDD, VSS — Regulator Output1 (Core Logic) Pins
/V
is the power input of VREG_3V3. All currents sourced into the regulator loads flow through
/V
Check device level specification for connectivity of the signals.
SS
SSA,
V
SS
are the primary outputs of VREG_3V3 that provide the power supply for the core logic.
REGEN
) can smooth ripple on V
V
which are supposed to be relatively quiet, are used to supply the analog parts of the
V
Name
V
V
V
DDPLL
V
SSPLL
V
DDR
DDA
SSA
DD
SS
(optional)
Power input (positive supply)
Quiet input (positive supply)
Quiet input (ground)
Primary output (positive supply)
Primary output (ground)
Secondary output (positive supply)
Secondary output (ground)
Optional Regulator Enable
MC9S12XDP512 Data Sheet, Rev. 2.21
DDR
Table 14-1. Signal Properties
should also be tied to ground on devices without VREGEN pin.
DDR
Function
DDA
DD
.
NOTE
/V
and V
SS
can replace the voltage regulator.
SSA
can further improve the quality of this
Chapter 14 Voltage Regulator (S12VREG3V3V5)
Reset State
—
—
—
—
—
—
—
—
DDR
Pull Up
—
—
—
—
—
—
—
—
and V
SSR
(if V
SSR
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