MC68332ACFC25 Freescale Semiconductor, MC68332ACFC25 Datasheet - Page 182
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MC68332ACFC25
Manufacturer Part Number
MC68332ACFC25
Description
IC MCU 32BIT 25MHZ 132-PQFP
Manufacturer
Freescale Semiconductor
Series
M683xxr
Specifications of MC68332ACFC25
Core Processor
CPU32
Core Size
32-Bit
Speed
25MHz
Connectivity
EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
15
Program Memory Type
ROMless
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
132-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC68332ACFC25
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC68332ACFC25
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
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A-8
10. When V
Notes for Tables A–5 and A–5a:
1. Applies to:
2. Input-Only Pins: EXTAL, TSTME/TSC, BKPT, T2CLK, RXD
3. Does not apply to HALT and RESET because they are open drain pins. Does not apply to Port QS [7:0] (TXD,
4. Current measured with system clock frequency of 16.78 MHz, all modules active.
5. Use of an active pulldown device is recommended.
6. Total operating current is the sum of the appropriate I
7.
8. Power dissipation measured at specified system clock frequency, all modules active. Power dissipation can be
9. This parameter is periodically sampled rather than 100% tested.
the V
ification. System noise on the V
Output-Only Pins: CSBOOT, BG/CS, CLKOUT, FREEZE/QUOT, IPIPE
Input/Output Pins:
PCS[3:1],ÊPCS0/SS, SCK, MOSI, MISO) in wired-OR mode.
rents for device modules powered by V
Volt. The RAM array cannot be accessed while the module is in standby mode.
calculated using the expression:
I
DD
includes supply currents for all device modules powered by V
STBY
Port E [7:4] — SIZ[1:0], AS, DS
Port F [7:0] — IRQ[7:1], MODCLK
Port QS [7:0] — TXD, PCS[3:1],ÊPCS0/SS, SCK, MOSI, MISO
TPUCH[15:0], T2CLK
BKPT/DSCLK, IFETCH, RESET, RXD, TSTME/TSC
EXTAL (when PLL enabled)
Group 1:
Group 2:
Group 3:
Group 4:
The RAM module will not switch into standby mode as long as V
DD
and V
is transitioning during power-up or power down sequence, and V
DD
P
pins, which causes standby current to increase toward the maximum transient condition spec-
D
DATA[15:0], IFETCH, TPUCH[15:0]
Port C [6:0] — ADDR[22:19]/CS[9:6], FC[2:0]/CS[5:3]
Port E [7:0] — SIZ[1:0], AS, DS, AVEC, RMC, DSACK[1:0]
Port F [&:0] — IRQ[7:1], MODCLK
Port QS [7:3] — TXD, PCS[3:1], PCS0/SS
ADDR23/CS10/ECLK, ADDR[18:0], R/W, BERR, BR/CS0, BGACK/CS2
HALT, RESET
MISO, MOSI, SCK
Maximum V
Freescale Semiconductor, Inc.
For More Information On This Product,
DD
ELECTRICAL CHARACTERISTICS
and V
DD
Go to: www.freescale.com
(I
DDE
DD
STBY
+ I
and V
DDSYN
pins can contribute to this condition.
DDI
+ I
pins.
DD
SB
, I
)
DDSYN
, and I
DDE
SB
and V
SB
does not exceed V
values. I
SB
DDI
is applied, current flows between
pins.
DD
values include supply cur-
USER’S MANUAL
DD
by more than 0.5
MC68332
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