MC68HC908SR12CB Freescale Semiconductor, MC68HC908SR12CB Datasheet - Page 384

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MC68HC908SR12CB

Manufacturer Part Number
MC68HC908SR12CB
Description
IC MCU 12K FLASH 8MHZ 42-SDIP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet

Specifications of MC68HC908SR12CB

Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, SCI
Peripherals
LVD, POR, PWM, Temp Sensor
Number Of I /o
29
Program Memory Size
12KB (12K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
42-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Electrical Specifications
Data Sheet
384
Operating frequency
Bus free time
Repeated start hold time.
Repeated start setup time.
Stop setup time
Hold time
Setup time
Clock low time-out
Clock low
Clock high
Slave clock low extend time
Master clock low extend time
Fall time
Rise time
Notes:
1. Devices participating in a transfer will timeout when any clock low exceeds the value of T
2. T
3. T
4. T
5. Rise and fall time is defined as follows: T
that have detected a timeout condition must reset the communication no later than T
value specified must be adhered to by both a master and a slave as it incorporates the cumulative limit for both a master
(10 ms) and a slave (25 ms).
Software should turn-off the MMIIC module to release the SDA and SCL lines.
to the stop. If a slave device exceeds this time, it is expected to release both its clock and data lines and reset itself.
defined from start-to-ack, ack-to-ack, or ack-to-stop.
HIGH MAX
LOW.SEXT
LOW.MEXT
Characteristic
provides a simple guaranteed method for devices to detect the idle conditions.
is the cumulative time a slave device is allowed to extend the clock cycles in one message from the initial start
is the cumulative time a master device is allowed to extend its clock cycles within each byte of a message as
Table 24-16. MMIIC Interface Input/Output Signal Timing
t
t
LOW.MEXT
LOW.SEXT
Symbol
t
t
t
t
t
t
TIMEOUT
SU.STO
HD.STA
SU.STA
HD.DAT
SU.DAT
t
t
f
t
HIGH
SMB
LOW
BUF
t
t
R
F
R
= (V
Electrical Specifications
ILMAX
Min
300
250
4.7
4.7
4.0
4.7
4.0
10
4.0
25
– 0.15) to (V
Typ
1000
IHMIN
Max
100
300
35
25
10
MC68HC908SR12•MC68HC08SR12 — Rev. 5.0
+ 0.15), T
Unit
kHz
ms
ms
ms
µs
µs
µs
µs
µs
µs
ns
ns
ns
ns
F
MMIIC operating frequency
Bus free time between STOP and
START condition
Hold time after (repeated) START
condition. After this period, the first
clock is generated.
Repeated START condition setup
time.
Stop condition setup time.
Data hold time.
Data setup time.
Clock low time-out.
Clock low period
Clock high period.
Cumulative clock low extend time
(slave device)
Cumulative clock low extend time
(master device)
Clock/Data Fall Time
Clock/Data Rise Time
= 0.9×V
TIMEOUT
TIMEOUT
DD
max of 35ms. The maximum
to (V
Freescale Semiconductor
Comments
(3)
min. of 25ms. Devices
ILMAX
(4)
(2)
(1)
(5)
– 0.15).
(5)

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