MCP6001UT-I/OT Microchip Technology, MCP6001UT-I/OT Datasheet - Page 37

• Manufacturer Part Number: MCP6001UT-I/OT
• Description: IC OPAMP SGL 1.8V R-R I/O SOT235
• Manufacturer: Microchip Technology

Specifications of MCP6001UT-I/OT

• Slew Rate: 0.6 V/µs
• Package / Case: SOT-23-5, SC-74A, SOT-25
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 1MHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 4500µV
• Current - Supply: 100µA
• Current - Output / Channel: 23mA
• Voltage - Supply, Single/dual (±): 1.8 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Channels: 1
• Common Mode Rejection Ratio (min): 60 dB
• Input Offset Voltage: 4.5 mV
• Input Bias Current (max): 19 pA
• Operating Supply Voltage: 3 V, 5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 6 V
• Supply Voltage (min): 1.8 V
• Technology: CMOS
• Voltage Gain Db: 112 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP6SX2DM-PCTLPD - BOARD DAUGHTER PICTAIL MCP6SX2
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MCP6001UT-I/OT; MCP6001UT-I/OTRTR; MCP6001UT-I/OTRTR; MCP6001UT-I/OTTR

APPENDIX A:
Revision J (November 2009)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. Updated
11. Updated the package drawings.
12. Updated the Product Identification System
Revision H (May 2008)
The following is the list of modifications:
1.
2.
3.
4.
5.
© 2009 Microchip Technology Inc.
Added new 2x3 DFN 8-Lead package on
page 1.
Updated the Temperature Specifications table
with 2x3 DFN thermal resistance information.
Updated Section 1.1 “Test Circuits”.
Updated
Added the 2x3 DFN column to
Added new Section 3.4 “Exposed Thermal
Pad (EP)”.
Updated Section 5.1 “SPICE Macro Model”.
Updated Section 5.5 “Analog Demonstration
and Evaluation Boards”.
Updated Section 5.6 “Application Notes”.
Information” with the new 2x3 DFN package
marking information.
section with new 2x3 DFN package information.
Design
Simulation Tool.
Package Types: Correct device labeling error.
Section 1.0 “Electrical Characteristics”, DC
Electrical Specifications: Changed “Maximum
Output Voltage Swing” condition from 0.9V Input
Overdrive to 0.5V Input Overdrive.
Section 1.0 “Electrical Characteristics”, AC
Electrical Specifications:
Margin condition from G = +1 to G= +1 V/V.
Section 5.0 “Design AIDS”: Name change for
Mindi Simulation Tool.
Figure
Aids:
Section 6.1
2-15.
REVISION HISTORY
Name
“Package
change
Changed Phase
Table
for
3-1.
Marking
Mindi
Revision G (November 2007)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Revision F (March 2005)
The following is the list of modifications:
1.
Revision E (December 2004)
The following is the list of modifications:
1.
2.
3.
Revision D (May 2003)
• Undocumented changes.
Revision C (December 2002)
• Undocumented changes.
Revision B (October 2002)
• Undocumented changes.
Revision A (June 2002)
• Original data sheet release.
MCP6001/1R/1U/2/4
Updated notes to Section 1.0 “Electrical
Characteristics”.
Increased Absolute Maximum Voltage range at
input pins.
Increased maximum operating supply voltage
(V
Added test circuits.
Added
Added
Section 4.1.2 “Input Voltage and Current
Limits”, Section 4.1.3 “Normal Operation”
and Section 4.5 “Unused Op Amps”.
Updated Section 5.0 “Design AIDS”,
Updated
Information”
Updated Package Outline Drawings.
Updated
Information” to include old and new packaging
examples.
V
±7.0 mV for parts starting with date code
YYWW = 0449
Corrected package markings in Section 6.0
“Packaging Information”.
Added Appendix A: Revision History.
OS
DD
).
specification reduced to ±4.5 mV from
Figure 2-3
Section 4.1.1
Section 6.0
Section 6.0
and
Figure
“Phase
2-20.
DS21733J-page 35
“Packaging
“Packaging
Reversal”,