USBULC6-2F3 STMicroelectronics, USBULC6-2F3 Datasheet

IC ESD PROTECTION ASD 4FLIPCHIP

USBULC6-2F3

Manufacturer Part Number
USBULC6-2F3
Description
IC ESD PROTECTION ASD 4FLIPCHIP
Manufacturer
STMicroelectronics
Datasheet

Specifications of USBULC6-2F3

Voltage - Reverse Standoff (typ)
3V
Voltage - Breakdown
6V
Power (watts)
60W
Polarization
2 Channel Array - Bidirectional
Mounting Type
Surface Mount
Package / Case
4-FlipChip
Applications
USB
Number Of Circuits
2
Voltage - Working
6V
Technology
Diode Array
Mounting Style
SMD/SMT
Diode Type
Low Capacitance
Power Dissipation Pd
60W
Diode Case Style
Flip Chip
No. Of Pins
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Clamping
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8166-2
USBULC6-2F3

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Features
Benefits
Complies with the following standards
Application
Description
The USBULC6-2F3 is a monolithic, application
specific discrete device dedicated to ESD
protection of high speed interfaces.
Its ultra low line capacitance secures a high level
of signal integrity without compromizing the
protection of downstream sensitive chips against
the most stringently characterized ESD strikes.
April 2008
2-line IPAD™, ultra low capacitance protection for high speed USB
Ultra low diode capacitance (1.2 pF max)
Two data lines (D+ and D-) protected against
15 kV ESD
Breakdown voltage V
Flip Chip 400 µm pitch, lead-free
Very low leakage current
Very small PCB area
RoHS compliant
Minimized impact on rise and fall times for
maximum data integrity
Low PCB space occupation
Higher reliability offered by monolithic
integration
IEC 61000-4-2 level 4 on external pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883G - Method 3015.7
– 25 kV (Human body model)
High speed USB port in wireless handsets (up
to 480 Mb/s according to USB 2.0 high speed
specification)
BR
= 6.0 V min
Rev 2
Figure 1.
Figure 2.
TM: IPAD is a trademark of STMicroelectronics.
Note: B1 and B2 bumps must be grounded on
Pin layout (bump side)
Device configuration
the PCB together
(4 bumps)
Flip Chip
USBULC6-2F3
A
A2
A1
B
2
1
B2
B1
www.st.com
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USBULC6-2F3 Summary of contents

Page 1

... High speed USB port in wireless handsets (up to 480 Mb/s according to USB 2.0 high speed specification) Description The USBULC6-2F3 is a monolithic, application specific discrete device dedicated to ESD protection of high speed interfaces. Its ultra low line capacitance secures a high level of signal integrity without compromizing the protection of downstream sensitive chips against the most stringently characterized ESD strikes ...

Page 2

... Voltage temperature coefficient V Forward voltage drop F Symbol Exponential wave form 8/20 µ line LINE 2/9 amb Parameter = 25 °C) amb Parameter RM Test conditions = mV MHz OSC USBULC6-2F3 = 25 °C) Value 125 - -55 to +150 Slope = 1/ Min. Typ. Max 100 1.6 5 1.2 Unit kV W °C °C ° ...

Page 3

... Figure 4. Eye diagram, board with USBULC6-2F3 (according to USB 2.0 high speed specification) USBULC6-2F3 480 Mb/s Horiz: 350 ps/div Ver: 200 mV/div Figure 6. ESD response to IEC 61000-4-2 (-15 kV air discharge) Figure 8. Analog crosstalk measurement dB 0 ...

Page 4

... F (Hz) -10.00 100.0k 1.0M 10.0M 100.0M Rise time = 1.647 205 mV pkpk Figure 12. Peak pulse power versus 1000 100 10 100 125 150 1 USBULC6-2F3 1.0G INPUT: 1 V/div 0 mV offset 2 ns/div 5 Gs/s OUTPUT: 100 m V/div -300 mV offset 2 ns/div 5 Gs/s exponential pulse duration (µ initial = 25° ...

Page 5

... USBULC6-2F3 Figure 13. Clamping voltage versus peak pulse current (typical values, exponential waveform) 100.0 10.0 1.0 V ( Application information Figure 15. Application diagram USB CONNECTOR Vbus GND Figure 14. Relative variation of leakage 1.E+02 1.E+01 8/20 µs T initial =25° 1.E+ Vbus GND Application information ...

Page 6

... ECOPACK trademark. ECOPACK specifications are available at www.st.com. Figure 17. Package dimensions 260 µm 6/9 MIN ead-free, pitch = 400 µm, bump = 255 µm 400 µm ± 40 255 µm ± 40 0.92 mm ± 30 µm USBULC6-2F3 USB ULC ® 605 µm ± 55 ...

Page 7

... More information is available in the application notes: AN2348: “400 µm Flip Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" 5 Ordering information Table 3. Ordering information Order code USBULC6-2F3 Figure 19. Marking Dot identifying Pin A1 location 0.71 User direction of unreeling Marking Package EH ...

Page 8

... Revision history 6 Revision history Table 4. Document revision history Date 15-Dec-2006 29-Apr-2008 8/9 Revision 1 Initial release. Updated ECOPACK statement. Updated 2 Figure 20. Reformatted to current standards. USBULC6-2F3 Changes Figure 17, Figure 18 and ...

Page 9

... USBULC6-2F3 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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